IC module, dual IC card, and method for manufacturing IC module

1. An IC module comprising:

a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole;

an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having a first terminal and a second terminal formed thereon;

a connecting coil formed on the first surface and having a first end and a second end;

a contact terminal portion provided to the second surface and configured to contact an external contact machine;

bridge wiring provided to the second surface, provided at a position overlapping with the first through hole and the second through hole as viewed in a thickness direction of the base, and electrically insulated from the contact terminal portion;

a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring;

a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and

a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.

2. The IC module of claim 1 , wherein the IC chip and the contact terminal portion are connected via an auxiliary conductive wire inserted through an auxiliary through hole formed in the base.

3. The IC module of claim 1 , further comprising a resin seal covering the IC chip, the first conductive wire, the second conductive wire, and the third conductive wire.

4. A dual IC card comprising:

the IC module according to claim 1 ; and

a plate-like card body provided with an antenna having a coupling coil electromagnetically coupled to the connecting coil of the IC module, and a main coil connected to the coupling coil to perform contactless communication with an external contactless machine, the card body having a recess formed therein to accommodate the IC module.

5. A method for manufacturing an IC module, comprising:

preparing a sheet-like base having a first surface and a second surface;

forming a connecting coil on the first surface;

forming, in the base, a first through hole and a second through hole spaced apart from each other;

forming, on the second surface, a contact terminal portion configured to contact an external contact machine;

forming, on the second surface, bridge wiring electrically insulated from the contact terminal portion, the bridge wiring overlapping with the first through hole and the second through hole as viewed in a thickness direction of the base;

mounting, on the first surface of the base, an IC chip having a contact communication function and a contactless communication function;

connecting the first terminal of the IC chip to the bridge wiring via a first conductive wire inserted through the first through hole;

connecting the bridge wiring to a first end of the connecting coil via a second conductive wire inserted through the second through hole; and

connecting a second end of the connecting coil to the second terminal of the IC chip via a third conductive wire.

6. The method for manufacturing an IC module of claim 5 , further comprising:

forming an auxiliary through hole in the base; and

connecting the IC chip to the contact terminal portion via an auxiliary conductive wire inserted through the auxiliary through hole.

7. The method for manufacturing an IC module of claim 5 , further comprising covering the IC chip, the first conductive wire, the second conductive wire, and the third conductive wire with a resin seal.