IP Library › Granted Patent US 10,111,368
Granted Patent B2
US 10,111,368 · App. 14/973,510 · Granted Oct 23, 2018

Flexible substrate retention on a reusable carrier

Inventors: Yoshihiro Tomita (Tsukuba, JP); Joshua D. Heppner (Chandler, AZ)
Assignee: Intel Corporation
H05K13/0069B23P19/04H01L23/40H01L23/544H05K1/0393H05K3/326H05K13/0023H01L23/4985H01L51/003H01L51/0097H01L2223/54426H01L2223/54486H05K2201/05Y10T29/49126Y10T29/53265
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Quick Facts
Patent No.
US 10,111,368
App. No.
14/973,510
Granted
Oct 23, 2018
Kind
B2
Abstract

Systems to manufacture an electronic circuit assembly are disclosed. In one embodiment, the system includes a flexible substrate with a substrate registration feature and a carrier with a carrier registration feature. A removable fastener removably fixes the flexible substrate to the carrier by being received into the substrate registration feature and the carrier registration feature. Once the flexible substrate is removably affixed to the carrier, the carrier provides the flexible substrate with rigidity to receive at least one electronic device of the electronic circuit assembly.

Claims (11)

1. A system to manufacture an electronic circuit assembly, comprising:

a flexible substrate to receive at least one electronic device of the electronic circuit assembly, wherein the flexible substrate comprises a substrate registration feature;

a primary carrier, with a primary carrier registration feature that comprises a post, to receive the flexible substrate; and

a secondary carrier that includes a split rivet to be received by the primary carrier registration feature to removably fix the flexible substrate to the primary carrier, wherein the flexible substrate is to receive the at least one electronic device of the electronic circuit assembly when the flexible substrate is affixed to the primary carrier,

wherein the post of the primary carrier is to be received by a vertical length of the split rivet of the secondary carrier to expand a head of the split rivet substantially horizontally against the substrate registration feature of the flexible substrate.

2. The system of claim 1 , wherein the flexible substrate comprises a polyimide film, a polyether ether ketone film, or a polyester film.

3. The system of claim 2 , wherein the primary carrier comprises metal or plastic.

4. The system of claim 2 , wherein the split rivet is to be received by the substrate registration feature to removably fix the flexible substrate to the primary carrier.

5. The system of claim 2 ,

wherein the split rivet is built into the secondary carrier; and

wherein the post is built into the primary carrier.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2015
From: TOMITA, YOSHIHIRO; HEPPNER, JOSHUA D.
To: INTEL CORPORATION
Reel/Frame 037326/0996 →
Continuity (1)
Related Publication 20170181338A1 · Jun 22, 2017