Light emitting device
A light emitting device includes: a package equipped with a lead that has an upper surface and a lower surface, and has a metal board and a plating layer formed on a surface of the metal board, the plating layer including a first plating layer provided to an upper surface of the metal board, and a second plating layer provided to a lower surface of the metal board, the first plating layer including nickel plating layer, gold plating layer and silver plating layer, and the second plating layer including no nickel plating layer and gold plating layer, and a molded resin that holds the lead; a light emitting element mounted in the package; and a sealing member that seals the light emitting element.
1. A light emitting device, comprising:
a package equipped with
a lead that has an upper surface and a lower surface, and has a metal board and a plating layer formed on a surface of the metal board, the plating layer including a first plating layer provided to an upper surface and lateral side surfaces of the metal board, and a second plating layer provided to a lower surface of the metal board, the first plating layer containing a nickel plating layer, a gold plating layer and a silver plating layer, and the second plating layer containing a silver plating layer and containing neither nickel nor gold, the silver plating layer of the second plating layer being integrated with the silver plating layer of the first plating layer with the silver plating layer being an outermost layer in the first plating layer and an outermost layer in the second plating layer; and
a molded resin that holds the lead;
a light emitting element mounted in the package; and
a sealing member that seals the light emitting element.
2. The light emitting device according to claim 1 , wherein
the first plating layer includes a palladium plating layer.
3. The light emitting device according to claim 1 , wherein
the first plating layer containing the nickel plating layer, a palladium plating layer, the gold plating layer and the silver plating layer formed on the metal board in this order.
4. The light emitting device according to claim 1 , wherein
the second plating layer contains only the silver plating layer.
5. The light emitting device according to claim 1 , wherein
a lower end of the first plating layer is substantially flush with the lower surface of the metal board.
6. The light emitting device according to claim 1 , wherein
the lead includes a protruding portion on an upper surface side of each of the lateral side surfaces.
7. The light emitting device according to claim 6 , wherein
a thickness of the protruding portion in a thickness direction of the lead is about one-half to one-fifth of a maximum thickness of the lead.
8. The light emitting device according to claim 6 , wherein
the first plating layer is provided to a lower surface of the protruding portion.
9. The light emitting device according to claim 1 , wherein
the lead includes an exposed portion exposed at a lateral side surface of the light emitting device.
10. The light emitting device according to claim 9 , wherein
the first plating layer is arranged in an outer periphery of the exposed portion.
11. The light emitting device according to claim 1 , wherein
the lead further includes a third plating layer provided on a surface of the second plating layer at a lower surface of the lead.
12. The light emitting device according to claim 11 , wherein
the lower surface of the lead protrudes more outwardly than a lower surface of the molded resin.