Magnetic small footprint inductor array module for on-package voltage regulator
An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
1. An apparatus comprising:
an inductor module including:
a module substrate including a magnetic dielectric material;
a first surface at the top of the inductor module and a second surface at the bottom of the inductor module;
a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil oriented to extend in the direction from the first surface to the second surface and including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and
a plurality of conductive contact pads electrically coupled to the first and second coil ends, wherein contact pads electrically coupled to the first coil ends are arranged on the first surface, and the contact pads electrically coupled to the second coil ends are arranged on the second surface.
2. The apparatus of claim 1 , wherein the magnetic dielectric material includes a magnetic particle polymer composite resin.
3. The apparatus of claim 1 , wherein the module substrate includes the magnetic dielectric in a first region and a non-magnetic dielectric region in a second region, wherein the first region includes the inductive circuit elements and the second region includes one or more signal vias, wherein a signal via is electrically coupled to a contact pad on the first surface of the inductor module and a contact pad on the second surface of the inductor module.
4. The apparatus of claim 1 , including:
a first integrated circuit (IC) including contact pads; and
conductive interconnect electrically coupling at least a portion of the contact pads of the inductor module to at least a portion of the contact pads of the IC.
5. The apparatus of claim 4 , wherein the first IC includes a voltage regulator circuit.
6. The apparatus of claim 5 , wherein the first IC is arranged on a surface of the inductor module.
7. The apparatus of claim 4 , including:
a package substrate of an electronic package assembly; and
a second IC that includes contact pads, wherein the inductor module and the second IC are arranged on a first surface of the package substrate, and the first IC is arranged on a surface of the inductor module, wherein the substrate includes conductive interconnect between contact pads of the inductor module and contact pads of the second IC.
8. The apparatus of claim 4 , including a package substrate of an electronic package assembly and a second IC; wherein the first IC is arranged on a surface of the inductor module, the inductor module is arranged on a first surface of the package substrate, and the second IC is arranged on a second surface of the substrate, wherein the second substrate includes contact pads and the substrate includes conductive interconnect between contact pads of the inductor module and contact pads of the second IC.
9. The apparatus of claim 4 , including a package substrate of an electronic package assembly, wherein the inductor module is arranged in the package substrate and the package substrate includes the conductive interconnect.
10. The apparatus of claim 9 , wherein the apparatus includes a second IC, wherein the first IC includes a voltage regulator circuit and is arranged on a first surface of the package substrate, the second IC includes a processor circuit arranged on a second surface of the package substrate, and the package substrate includes the conductive interconnect electrically coupling at least a portion of the contact pads of the inductor module to at least a portion of the contact pads of the first IC, and includes conductive interconnect electrically coupling at least a portion of the contact pads of the first IC to at least a portion of the contact pads of the second IC.
11. The apparatus of claim 1 , wherein the inductor module includes a thru module topology, and an inductive circuit element of the plurality of inductive circuit elements extends from a contact pad arranged on the first surface at the top of the inductor module to a contact pad arranged on the bottom surface of the inductor module.