Gradient encapsulant protection of devices in stretchable electronics

1. An apparatus comprising:

an electrical device on a stretchable substrate;

one or more stretchable electrical interconnects coupled with the electrical device;

one or more electrical components electrically coupled with the electrical device via the one or more stretchable electrical interconnects; and

a gradient encapsulating material layered over and fully surrounding the electrical device and at least a portion of the one or more stretchable electrical interconnects coupled thereto, wherein the gradient encapsulating material has an elastic modulus greater than the stretchable substrate and wherein the elastic modulus of the gradient encapsulating material is less than the electrical device, and wherein the gradient encapsulating material has a first elastic modulus proximate the electrical device and a second elastic modulus proximate the stretchable substrate, the second elastic modulus lower than the first elastic modulus.

2. The apparatus of claim 1 :

wherein the gradient encapsulating material layered over and fully surrounding the electrical device is a mix of an elastomer with high modulus filler particles to form a gradient elastomer layered over and fully surrounding the electrical device; and

wherein the gradient elastomer is fabricated with a gradation of the high modulus filler particles distributed non-uniformly through the gradient encapsulating material forming a modulus of the gradient encapsulating material which reduces with increasing distance from the electrical device.

3. The apparatus of claim 1 :

wherein the gradient encapsulating material layered over and fully surrounding the electrical device is a mix of an elastomer with SiO 2 (Silicon dioxide) particles which respond to electrical stimuli; and wherein an electrical stimuli applied to the gradient encapsulating material prior to or during a curing process of the gradient encapsulating material causes the SiO 2 particles to aggregate more densely nearer the electrical device creating a higher modulus of the gradient encapsulating material nearer the electrical device and to aggregate less densely farther from the electrical device creating a lower modulus of the gradient encapsulating material farther from the electrical device.

4. The apparatus of claim 1 :

wherein the gradient encapsulating material layered over and fully surrounding the electrical device is a mix of an elastomer with FeO (ferrous oxide) particles which respond to stimuli of a magnetic field; and

wherein the magnetic field applied to the gradient encapsulating material prior to or during a curing process of the gradient encapsulating material causes the FeO particles to aggregate more densely nearer the electrical device creating a higher modulus of the gradient encapsulating material nearer the electrical device and to aggregate less densely farther from the electrical device creating a lower modulus of the gradient encapsulating material farther from the electrical device.

5. The apparatus of claim 1 :

wherein the gradient encapsulating material layered over and fully surrounding the electrical device is formed from at least two or more layers;

wherein a first layer of the gradient encapsulating material corresponds to a first modulus, the first modulus of the first layer being greater than the stretchable substrate and less than the electrical device; and

wherein a second layer of the gradient encapsulating material corresponds to a second modulus, the second modulus being greater than the stretchable substrate and less than the electrical device and different than the first modulus of the first layer.

6. The apparatus of claim 5 :

wherein the modulus of the gradient encapsulating material constituting at least the first and second layers varies in elasticity with increasing distance from the electrical device on a horizontal plane and varies in elasticity with increasing height from the electrical device on a vertical plane.

7. The apparatus of claim 1 , wherein the electrical device comprises an integrated circuit and wherein the one or more electrical components electrically coupled with the electrical device comprise any one of:

a battery, a sensor, a transceiver, a system on a chip (SOC).

8. The apparatus of claim 1 , wherein the electrical device comprises a module package comprising at least a microelectronic die embedded in a processor and a memory and one or more communication circuits.

9. The apparatus of claim 1 :

wherein the one or more stretchable electrical interconnects coupled with the electrical device comprise electrical traces integrated into the stretchable substrate; and

wherein the one or more stretchable electrical interconnects are coupled with the electrical device via at least one of electrical bonds, electrical pads, or flip chip interconnects.

10. The apparatus of claim 1 , wherein the stretchable substrate comprises one of a stretchable polydimethylsiloxane (PDMS) substrate, a stretchable Polyisoprene substrate, a stretchable polybutadiene substrate, a stretchable polyisobutylene substrate, a stretchable polyurethanes substrate, a stretchable thermoplasticpolyurethanes substrate, a stretchable butyl rubber substrate, a stretchable nitrile rubber substrate, or a stretchable woven fabric substrate.

11. The apparatus of claim 10 : wherein the stretchable substrate is layered over a dielectric material having the stretchable electrical interconnects integrated therein, wherein the stretchable electrical interconnects comprise one of meandering copper wires, electrical traces, springs wires, coiled wires, or spiraled wires; and wherein the stretchable electrical interconnects provide an electrical and communications interface between the electrical device and one or more electrical components through the dielectric material.

12. The apparatus of claim 1 , wherein the apparatus is embedded within one of:

a clothing item;

sports attire;

a shoe;

a wearable technology to be worn as a clothing item or an accessory;

fashion electronics to be worn as a clothing item or an accessory;

tech togs to be worn as a clothing item or an accessory;

fashionable technology to be worn as a clothing item or an accessory; or a flexible wearable technology to be worn as a clothing item or an accessory.

13. A wearable technology to be worn as a clothing item or an accessory, the wearable technology comprising:

an integrated circuit on a stretchable substrate;

one or more stretchable electrical interconnects coupled with the integrated circuit;

one or more electrical components electrically coupled with the integrated circuit via the one or more stretchable electrical interconnects; and

a gradient encapsulating material layered over and fully surrounding the integrated circuit and at least a portion of the one or more stretchable electrical interconnects coupled with the integrated circuit, wherein the gradient encapsulating material has an elastic modulus greater than the stretchable substrate and wherein the elastic modulus of the gradient encapsulating material is less than the integrated circuit, and wherein the gradient encapsulating material has a first elastic modulus proximate the electrical device and a second elastic modulus proximate the stretchable substrate, the second elastic modulus lower than the first elastic modulus.

14. The wearable technology of claim 13 , wherein the wearable technology is embodied within one of:

a clothing item;

sports attire;

a shoe;

fashion electronics to be worn as a clothing item or an accessory; tech togs to be worn as a clothing item or an accessory;

fashionable technology to be worn as a clothing item or an accessory; or

a flexible wearable technology to be worn as a clothing item or an accessory.

15. The wearable technology of claim 13 :

wherein the gradient encapsulating material layered over and fully surrounding the integrated circuit is a mix of an elastomer with particles which respond to stimuli; and

wherein a stimuli applied to the gradient encapsulating material prior to or during a curing process of the gradient encapsulating material causes the particles to aggregate more densely nearer the integrated circuit creating a higher modulus of the gradient encapsulating material nearer the integrated circuit and to aggregate less densely farther from the integrated circuit creating a lower modulus of the gradient encapsulating material farther from the integrated circuit.