Testing method for semiconductor manufacturing equipment
View Patent ↗The time required to test an electronic device mounted in semiconductor manufacturing equipment can be reduced. A first test panel mounted, on a first connector surface thereof, with plural first test-object connectors respectively including plural first terminals electrically coupled to an electronic device and a second test panel mounted, on a second connector surface thereof, with plural second test-object connectors respectively including plural spring probes are provided. The first connector surface of the first test panel and the second connector surface of the second test panel are positioned to face each other, the spring probes included in the second test-object connectors are electrically coupled to the first terminals included in the first test-object connectors, and a functional test concerning an electrical characteristic of the electronic device is performed.
1. A testing method for semiconductor manufacturing equipment comprising the steps of:
(a) providing a first test panel which includes a first connector surface and a plurality of first test-object connectors mounted over the first connector surface, each of the plurality of first test object connectors having a terminal electrically coupled with an object to be tested,
(b) providing a second test panel which includes a second connector surface and a plurality of second test-object connectors mounted over the second connector surface, each of the plurality of second test object connectors having a probe that is extensible and retractable in a direction from the second connector surface of the second test panel toward the first connector surface of the first test panel, and
(c) testing an electrical characteristic of the object to be tested by, in a state with the first connector surface of the first test panel and the second connector surface of the second test panel facing each other, coupling the probes of the second test-object connectors to respective terminals of the first test-object connectors,
wherein the distances between the first connector surface of the first test panel and the terminals respectively included in the first test-object connectors are not uniform.
2. The testing method for semiconductor manufacturing equipment according to claim 1 , wherein the distances between the second connector surface of the second test panel and respective tips of the probes are uniform in the second test-object connectors.
3. The testing method for semiconductor manufacturing equipment according to claim 1 ,
wherein the terminals respectively included in the first test-object connectors each include:
a first group of terminals having a first distance from the first connector surface of the first test panel; and
a second group of terminals having a second distance shorter than the first distance from the first connector surface of the first test panel,
wherein the probes respectively included in the second test-object connectors each include:
a first group of probes facing the first group of terminals; and
a second group of probes facing the second group of terminals, and
wherein, after respective tips of the first group of probes contact the first group of terminals, respective tips of the second group of probes contact the second group of terminals.
4. The testing method for semiconductor manufacturing equipment according to claim 3 , wherein a relationship of L 1 ≧L 2 is kept, L 1 representing the distance, in a state with neither the tips of the first group of probes contacting the first group of terminals nor the tips of the second group of probes contacting the second group of terminals, between the tips of the probes respectively projecting from the second test-object connectors and the second test-object connectors, L 2 representing the distance, when the tips of the second group of probes contact the second group of terminals after the first group of terminals are contacted by the tips of the first group of probes causing the first group of probes to be immovable, between the tips of the probes respectively projecting from the second test-object connectors and the second test-object connectors.
5. The testing method for semiconductor manufacturing equipment according to claim 1 , further comprising the step of:
fixing the second test panel to the first test panel by coupling a fixing mechanism of the second test panel to an outer portion of the first test panel.
6. The testing method for semiconductor manufacturing equipment according to claim 1 , wherein the second test panel has markings provided on a surface thereof which, not facing the first connector surface of the first test panel, is opposite to the second connector surface of the second test panel, the markings identifying the terminals included in the first test-object connectors.
7. The testing method for semiconductor manufacturing equipment according to claim 1 , wherein the tips of the probes are conical.
8. The testing method for semiconductor manufacturing equipment according to claim 1 , wherein the probes each have an end face including a plurality of projections to cause the end face of each of the probes to be coupled to a corresponding one of the terminals via a plurality of contact points.