Verification method of mask pattern, manufacturing method of a semiconductor device and nontransitory computer readable medium storing a mask pattern verification program

1. A mask pattern verification method by mask pattern verification circuitry, the method comprising:

receiving, by the circuitry, designed layout data for generating a mask pattern of a photomask that is used to pattern a resist film applied on a substrate of a semiconductor device for manufacturing the semiconductor device by optical lithography;

calculating, by the circuitry, an inscribed figure as a circle or an oval inscribed in a rectangular pattern of the received designed layout data;

calculating, by the circuitry, an optical lithographic shape that corresponds to the rectangular pattern and a resist pattern being formed on the resist film;

calculating, by the circuitry, a difference in area between the optical lithographic shape and the inscribed figure; and

determining, by the circuitry, for verifying the mask pattern, whether the difference in area satisfies a predetermined specification.

2. The mask pattern verification method of claim 1 , wherein

the optical lithographic shape is calculated by the circuitry using an optical lithographic simulation.

3. The mask pattern verification method of claim 2 , wherein

the rectangular pattern includes:

a first rectangular pattern; and

a second rectangular pattern larger in area than the first rectangular pattern, and

in the optical lithographic simulation, when the shape of illumination is set to obtain a desired shape for the first rectangular pattern, an optical lithographic shape for the second rectangular pattern is calculated by the circuitry.

4. The mask pattern verification method of claim 1 , wherein

the optical lithographic shape is calculated by the circuitry after a proximity effect correction to the rectangular pattern is executed by the circuitry.

5. The mask pattern verification method of claim 1 , wherein

the calculating of the optical lithographic shape is executed using auxiliary patterns applied to a periphery of the rectangular pattern, and

when the difference in area does not satisfy the predetermined specification, the positions, sizes, or shapes of the auxiliary patterns are changed by the circuitry.

6. The mask pattern verification method of claim 5 , wherein

the positions, sizes, or shapes of the auxiliary patterns are changed by the circuitry based on areas divided by line segments linking the center of the inscribed figure and the centers of the auxiliary patterns.

7. The mask pattern verification method of claim 1 , wherein

when the optical lithographic shape is arranged in contact with the inscribed figure at four points, differences among four areas corresponding to the four corners of the optical lithographic shape are calculated by the circuitry.

8. The mask pattern verification method of claim 1 , wherein

when the optical lithographic shape is arranged in contact with the inscribed figure at three points and the optical lithographic shape resides inside the inscribed figure, the area between the optical lithographic shape and the inscribed figure is divided, and four areas corresponding to the four corners of the optical lithographic shape are calculated by the circuitry.

9. The mask pattern verification method of claim 1 , wherein

when the optical lithographic shape is arranged in contact with the inscribed figure at three points and the optical lithographic shape extends off the inscribed figure, the extended portion of the optical lithographic shape is removed and four areas corresponding to the four corners of the optical lithographic shape are calculated by the circuitry.

10. A manufacturing method of a semiconductor device, comprising:

receiving designed layout data for generating a mask pattern of a photomask that is used to pattern a resist film applied on a substrate of a semiconductor device for manufacturing the semiconductor device by optical lithography;

calculating an inscribed figure as a circle or an oval inscribed in a rectangular pattern of the received designed layout data;

calculating an optical lithographic shape that corresponds to the rectangular pattern and a resist pattern being formed on the resist film;

calculating a difference in area between the optical lithographic shape and the inscribed figure;

determining whether the difference in area satisfies a predetermined specification;

when the difference in area satisfies the predetermined specification, performing optical lithography of a resist film on a processing film on a semiconductor substrate based on a mask pattern corresponding to the designed layout data; and

treating the processing film based on a resist pattern obtained by the optical lithography.

11. The manufacturing method of a semiconductor device of claim 10 , wherein

a hole pattern corresponding to the rectangular pattern is formed on the resist film by the optical lithography.

12. The manufacturing method of a semiconductor device of claim 11 , wherein

the rectangular pattern includes:

a first rectangular pattern; and

a second rectangular pattern larger in area than the first rectangular pattern, and

when the shape of illumination in the optical lithography is set to obtain a hole pattern for the first rectangular pattern, the predetermined specification is set such that a hole pattern is obtained for the second rectangular pattern.

13. The manufacturing method of a semiconductor device of claim 10 , wherein

the optical lithographic shape is calculated by an optical lithographic simulation.

14. The manufacturing method of a semiconductor device of claim 10 , wherein

the optical lithographic shape is calculated after execution of a proximity effect correction to the rectangular pattern.

15. The manufacturing method of a semiconductor device of claim 10 , wherein

the calculating of the optical lithographic shape is executed using auxiliary patterns applied to a periphery of the rectangular pattern, and

when the difference in area does not satisfy the predetermined specification, the positions, sizes, or shapes of the auxiliary patterns are changed.

16. A non-transitory computer-readable storage medium storing a mask pattern verification program for causing a computer to:

receive designed layout data for generating a mask pattern of a photomask that is used to pattern a resist film applied on a substrate of a semiconductor device for manufacturing the semiconductor device by optical lithography;

calculate an inscribed figure as a circle or an oval inscribed in a rectangular pattern of the received designed layout data;

calculate an optical lithographic shape that corresponds to the rectangular pattern and a resist pattern being formed on the resist film;

calculate a difference in area between the optical lithographic shape corresponding to the rectangular pattern and the inscribed figure; and

determine, for verifying the mask pattern, whether the difference in area satisfies a predetermined specification.

17. The non-transitory computer-readable storage medium of claim 16 , wherein

the computer is caused to calculate the optical lithographic shape by an optical lithographic simulation.

18. The non-transitory computer-readable storage medium of claim 16 , wherein

the rectangular pattern includes:

a first rectangular pattern; and

a second rectangular pattern larger in area than the first rectangular pattern, and

in the optical lithographic simulation, when the shape of illumination is set to obtain a desired shape for the first rectangular pattern, an optical lithographic shape for the second rectangular pattern is calculated.

19. The non-transitory computer-readable storage medium of claim 16 , wherein

the computer is caused to calculate the optical lithographic shape after being caused to execute a proximity effect correction to the rectangular pattern.

20. The non-transitory computer-readable storage medium of claim 16 , wherein

the calculating of the optical lithographic pattern is executed using auxiliary patterns applied to a periphery of the rectangular pattern, and the computer is caused to, when the difference in area does not satisfy the predetermined specification, change the positions, sizes, or shapes of the auxiliary patterns.