Organic light emitting display device and method of manufacturing the same
An organic light emitting display device and a method of manufacturing the same are provided that may reduce the resistance of a second electrode and may prevent corrosion and metal migration of a pad electrode without adding a separate mask process, or while reducing the number of mask processes. In the organic light emitting display device, an auxiliary line is connected to a second electrode through an auxiliary electrode, which is provided in the same layer as a first electrode, and a pad cover electrode is configured to cover an upper surface and a side surface of a pad connection electrode so as to prevent the pad connection electrode connected to a pad from being exposed outward.
1. An organic light emitting display device, comprising:
a substrate including a pixel area and a pad area;
a thin film transistor provided in the pixel area of the substrate;
a first electrode electrically connected to the thin film transistor;
an organic emission layer provided on the first electrode;
a second electrode provided on the organic emission layer;
an auxiliary electrode connected to the second electrode, the auxiliary electrode being provided in the same layer as the first electrode;
an auxiliary line connected to the auxiliary electrode and provided below the auxiliary electrode to overlap with the auxiliary electrode;
an auxiliary cover line provided on the auxiliary line so as to cover an upper surface and a side surface of the auxiliary line;
a pad provided in the pad area of the substrate;
a pad connection electrode provided on the pad; and
a pad cover electrode provided on the pad connection electrode,
wherein the pad cover electrode is provided to cover an upper surface and a side surface of the pad connection electrode so that the pad connection electrode is not exposed outward, and
wherein the auxiliary cover line is composed of the same material as the pad cover electrode.
2. The device according to claim 1 , wherein the pad cover electrode has a smaller extent of oxidation than an extent of oxidation of the pad connection electrode.
3. The device according to claim 1 , wherein the pad connection electrode is composed of the same material as the auxiliary line.
4. The device according to claim 1 , wherein the thin film transistor and the first electrode are connected to each other via a connection line, and the connection line is provided in the same layer as the auxiliary line.
5. The device according to claim 4 , wherein a first protective layer is provided between the first electrode and the connection line,
wherein a second protective layer is provided between the auxiliary electrode and the auxiliary line, and
wherein the first protective layer and the second protective layer are spaced apart from each other.
6. The device according to claim 5 , wherein a bank is provided between the first protective layer and the second protective layer facing each other.
7. The device according to claim 4 , wherein a connection cover line is provided on the connection line so as to cover an upper surface and a side surface of the connection line, and
wherein a side surface of the connection cover line is exposed.
8. The device according to claim 1 , further comprising a bank disposed along a rim of the first electrode.