IP Library Granted Patent US 9,443,562
Granted Patent B2
US 9,443,562 · App. 14/982,362 · Granted Sep 13, 2016

Connections for memory electrode lines

Inventors: Fabio Pellizzer (Cornate D'Adda, IT); Everardo Torres Flores (Folsom, CA); Hernan A. Castro (Shingle Springs, CA)
Assignee: MICRON TECHNOLOGY, INC.
G11C5/063G11C13/0028H01L23/528H01L27/0207
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Quick Facts
Patent No.
US 9,443,562
App. No.
14/982,362
Granted
Sep 13, 2016
Kind
B2
Abstract

Subject matter disclosed herein may relate to word line electrodes and/or digit line electrodes in a cross-point array memory device. One or more word line electrodes may be configured to form a socket area to provide connection points to drivers and/or other circuitry that may be located within a footprint of an array of memory cells.

Claims (35)

1. A system comprising:

a plurality of memory cells having stored therein one or more data states;

a plurality of memory electrode lines extending parallel to one another along a first direction, wherein each memory electrode line is electrically coupled to at least one of the memory cells;

a first subset of the memory electrode lines that terminate at different positions along the first direction;

a second subset of the memory electrode lines that extend through a socket region without terminating, wherein each memory electrode line of the second subset of the memory electrode lines forms a jog segment within the socket region, each jog segment deviating from parallel to the first direction; and

a plurality of vertical connectors each contacting one of the second subset of memory electrode lines at a jog segment.

2. The system of claim 1 , wherein each memory electrode line of the second subset has an electrode length in the first direction, wherein the jog segment is located at a substantially central location along the electrode length.

3. The system of claim 2 , further comprising one or more memory electrode line drivers positioned in a semiconductor material and arranged in an at least partially repeating pattern of alternating memory electrode line drivers, wherein each memory electrode line driver is electrically coupled to a memory electrode line of the second subset at a jog segment.

4. The system of claim 1 , wherein the first subset of the memory electrode lines and the second subset of memory electrode lines form a bundle of at least four memory electrode lines.

5. The system of claim 1 , wherein each jog segment of a first group of the second subset of the memory electrode lines deviates from the first direction toward a first side, and wherein each jog segment of a second group of the second subset of the memory electrode lines deviates from the first direction toward a second side different from the first side.

6. The system of claim 5 , wherein the second side is opposite the first side.

7. The system of claim 1 , wherein a shortest distance from an edge of one jog segment to a corresponding edge of an immediately adjacent jog segment in the first direction is at least four times a minimum feature size F of a memory electrode line.

8. The system of claim 1 , wherein the plurality of memory electrode lines comprise:

memory word lines, or memory digit lines, or a memory word line and a memory digit line.

9. A system comprising:

a plurality of memory electrode lines positioned along a first direction, wherein at least one memory electrode line is electrically coupled to a memory cell;

a first subset of the memory electrode lines extending through a socket region and each forming a jog segment within the socket region; and

a plurality of vertical connectors each contacting the jog segment of one of the first subset of memory electrode lines.

10. The system of claim 9 , further comprising:

a second subset of the memory electrode lines, wherein each of the second subset of the memory electrode lines contacts one of the vertical connectors and terminates in the socket region after contacting one of the vertical connectors.

11. The system of claim 9 , wherein a lateral dimension of at least one of the plurality of vertical connectors is greater than a minimum feature size F of at least one of the plurality of memory electrode lines.

12. The system of claim 9 , wherein a lateral dimension of at least one of the plurality of vertical connectors is at least twice a minimum feature size F of the first subset of the memory electrode lines.

13. The system of claim 9 , wherein a length of the jog segment is at least twice a minimum feature size F of a memory electrode line in the first subset of the memory electrode lines.

14. The system of claim 13 , wherein at least two jog segments are a same length.

15. The system of claim 9 , wherein at least one jog segment is perpendicular to the first direction.

16. The system of claim 9 , wherein a first jog segment is parallel to a second jog segment.

17. A method comprising:

forming a plurality of conductive lines below a plurality of electrode lines; and

electrically connecting the plurality of conductive lines to the plurality of electrode lines using a vertical connector disposed between each of the plurality of conductive lines and each of the plurality of electrode lines.

18. The method of claim 17 , wherein forming the plurality of conductive lines comprises:

forming the plurality of conductive lines in a metal interconnect layer.

19. The method of claim 17 , wherein forming the plurality of conductive lines comprises:

forming a hard mask in a pattern within a plurality of memory cells that creates the plurality of conductive lines extending along a first direction and terminating at different positions along the first direction.

20. The method of claim 17 , wherein forming the hard mask comprises:

forming a mask having a lithographic resolution coarser than a minimum feature size F of a memory array.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (2)
Division 13777811 · Feb 26, 2013
Related Publication 20160133300A1 · May 12, 2016