Method for processing ceramic scintillator array
A method for processing a ceramic scintillator array, characterized in that, comprising the following steps: (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using laser; (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive; (c) forming, in a second direction. a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using laser, wherein the second direction is perpendicular to the first direction; and (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive bond.
1. A method for processing a ceramic scintillator array, comprising:
(a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using a laser beam;
(b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive;
(c) forming, in a second direction, a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using the laser beam, wherein the second direction is perpendicular to the first direction;
(d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive;
(e) polishing both end surfaces of the scintillator substrate until the scintillator substrate has a required thickness; and
(f) cutting the scintillator substrate, with a circular diamond blade, into narrow bars along the cuts formed by laser cutting process, wherein each narrow bar has a predetermined number of rows.
2. The method for processing a ceramic scintillator array according to claim 1 , wherein the adhesive used in the step (b) and in the step (d) is a light-reflective cement.
3. The method for processing a ceramic scintillator array according to claim 1 , wherein the scintillator substrate is obtained by cutting a block of ceramic scintillator into slices each having a predetermined thickness, wherein the block of ceramic scintillator is obtained by using one of a hot-pressing hot-isostatic-pressing two-step sintering process, a spark-plasma one-step sintering process and a spark-plasma hot-isostatic-pressing two-step sintering process.
4. The method for processing a ceramic scintillator array according to claim 1 , wherein the step (a) comprises:
adjusting a laser device in a laser cutting system, forming melting spots each having a predetermined size on the scintillator substrate, overlapping a number of melting spots resulted from pulses of laser with each other by adjusting a frequency of the pulses of laser and a translational speed of a working platform such that the scintillator substrate is melted through at an overlapped spot;
moving the melting spots resulted from the pulses of laser in the first direction by an appropriate distance and overlapping the melting spots with an edge of a previous overlapped spot, such that the scintillator substrate is melted through at a new overlapped spot; and
repeating the process in this way until the straight first-direction through-cut is formed.
5. The method for processing a ceramic scintillator array according to claim 1 , wherein the method further comprises, after the step (f), a step (g) of cleaning up contaminants remaining on the scintillator substrate by using a cleaning agent.
6. The method for processing a ceramic scintillator array according to claim 4 , wherein the method further comprises, after the step (f), a step (g) of cleaning up contaminants remaining on the scintillator substrate by using a cleaning agent.
7. The method for processing a ceramic scintillator array according to claim 5 , wherein the cleaning agent uses one or more of solvents comprising acetone, carbon tetrachloride, trichloroethylene, and petroleum ether.
8. The method for processing a ceramic scintillator array according to claim 6 , wherein the cleaning agent uses one or more of solvents comprising acetone, carbon tetrachloride, trichloroethylene, and petroleum ether.
9. The method for processing a ceramic scintillator array according to claim 1 , wherein the step (a) further comprises: blowing slags away from the cuts by using a high-pressure high-purity inert gas during formation of the first-direction through-cuts.
10. The method for processing a ceramic scintillator array according to claim 4 , wherein the step (a) comprises: blowing slags away from the cuts by using a high-pressure high-purity inert gas during formation of the first-direction through-cuts.
11. The method for processing a ceramic scintillator array according to claim 1 , wherein the step (b) comprises: bonding adhesive tapes to a bottom surface of the scintillator substrate which has been provided with the first-direction through-cuts, sealing the first-direction through-cuts on one side to form leakproof grooves, and pouring the light-reflective cement containing a light-reflective coating into the grooves so that the light-reflective cement is adequately filled in the first-direction through-cuts and is solidified.
12. The method for processing a ceramic scintillator array according to claim 4 , wherein the step (b) comprises: bonding adhesive tapes to a bottom surface of the scintillator substrate which has been provided with the first-direction through-cuts, sealing the first-direction through-cuts on one side to form leakproof grooves, and pouring the light-reflective cement containing a light-reflective coating into the grooves so that the light-reflective cement is adequately filled in the first-direction through-cuts and is solidified.
13. The method for processing a ceramic scintillator array according to claim 1 , wherein the step (e) comprises: polishing an end surface of the scintillator substrate which is selected as a coupling surface.
14. The method for processing a ceramic scintillator array according to claim 1 , wherein the laser beam is emitted from one of a pulsed laser device and a continuous laser device.
15. The method for processing a ceramic scintillator array according to claim 8 , wherein the step (b) comprises bonding adhesive tapes to a bottom surface of the scintillator substrate which has been provided with the first-direction through-cuts, sealing the first-direction through-cuts on one side to form leak-proof grooves, and pouring the light-reflective cement containing a light-reflective coating into the grooves so that the light-reflective cement is adequately filled in the first-direction through-cuts and is solidified.
16. The method for processing a ceramic scintillator array according to claim 15 , wherein the scintillator substrate is obtained by cutting a block of ceramic scintillator into slices each having a predetermined thickness, wherein the block of ceramic scintillator is obtained by using one of a hot-pressing hot-isostatic-pressing two-step sintering process, a spark-plasma one-step sintering process and a spark-plasma hot-isostatic-pressing two-step sintering process.
17. The method for processing a ceramic scintillator array according to claim 16 , wherein the step (e) comprises polishing an end surface of the scintillator substrate which is selected as a coupling surface.
18. The method for processing a ceramic scintillator array according to claim 17 , wherein the laser beam is emitted from one of a pulsed laser device and a continuous laser device.
19. The method for processing a ceramic scintillator array according to claim 12 , wherein the adhesive used in the step (b) and in the step (d) is a light-reflective cement.
20. The method for processing a ceramic scintillator array according to claim 19 , wherein the scintillator substrate is obtained by cutting a block of ceramic scintillator into slices each having a predetermined thickness, wherein the block of ceramic scintillator is obtained by using one of a hot-pressing hot-isostatic-pressing two-step sintering process, a spark-plasma one-step sintering process and a spark-plasma hot-isostatic-pressing two-step sintering process.