IP Library Granted Patent US 9,735,290
Granted Patent B2
US 9,735,290 · App. 14/984,880 · Granted Aug 15, 2017

Semiconductor device

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Quick Facts
Patent No.
US 9,735,290
App. No.
14/984,880
Granted
Aug 15, 2017
Kind
B2
Abstract

An integrated diode ( 100 ) comprising a substrate ( 102 ); a Schottky cell ( 104 ) on the substrate ( 102 ); a heterojunction cell ( 106 ) on the substrate ( 102 ); a common anode contact ( 108 ) for both the Schottky cell ( 104 ) and the heterojunction cell ( 106 ); and a common cathode contact ( 110 ) for both the Schottky cell ( 104 ) and the heterojunction cell ( 106 ).

Claims (15)

1. An integrated diode comprising:

a substrate;

a Schottky cell on the substrate;

a heterojunction cell on the substrate;

a common anode contact for both the Schottky cell and the heterojunction cell;

a common cathode contact for both the Schottky cell and the heterojunction cell; and

a guard collar positioned at the periphery of the heterojunction cell and between the Schottky cell and the heterojunction cell for terminating the heterojunction cell with respect to the Schottky cell.

2. The integrated diode of claim 1 , wherein the Schottky cell is in parallel with the heterojunction cell between the common anode contact and the common cathode contact.

3. The integrated diode of claim 1 , wherein the Schottky cell is adjacent to the heterojunction cell on the substrate.

4. The integrated diode of claim 1 , wherein the integrated diode is a planar device.

5. The integrated diode of claim 1 , wherein the guard collar comprises boron doped silicon.

6. The integrated diode of claim 1 , wherein the common anode contact and the common cathode contact comprise one or more of a metal, an alloy, a silicide, and a disilicide.

7. The integrated diode of claim 1 , wherein the common anode contact and/or the common cathode contact comprise:

a first material for the Schottky cell; and

a second, different, material for the heterojunction cell.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2015
From: BOETTCHER, TIM; FISCHER, JAN PHILIPP; IGEL-HOLTZENDORFF, THOMAS
To: NXP B.V.
Reel/Frame 037386/0693 →