IP Library Granted Patent US 11,198,245
Granted Patent B2
US 11,198,245 · App. 14/985,465 · Granted Dec 14, 2021

Solid freeform fabrication of shelled objects

Inventors: Daniel Dikovsky (Ariel, IL); Avraham Levy (Petach-Tikva, IL); Eduardo Napadensky (Natania, IL)
Assignee: Stratasys Ltd.
B29C64/112B29C64/135B29C64/393B29K2995/0015B33Y10/00B33Y50/02Y10T428/23
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Quick Facts
Patent No.
US 11,198,245
App. No.
14/985,465
Granted
Dec 14, 2021
Kind
B2
Abstract

A method of layerwise solid freeform fabrication is disclosed. The method comprises, for each of at least a few of the layers, dispensing and hardening at least a first modeling material and a second modeling material to form a core region and one or more envelope regions at least partially surrounding the core region. In some embodiments, the ratio between the elastic moduli of adjacent regions, when hardened, is from about 1 to about 20.

Claims (9)

1. A computerized controller for a solid freeform fabrication (SFF) system having a fabrication apparatus and a building material supply apparatus supplying a plurality of modeling materials to said fabrication apparatus, the computerized controller comprising a circuit configured to operate the fabrication apparatus of said SFF system to receive at least a first modeling material and a second modeling material from said supply apparatus, to dispense and harden said received first and said second modeling materials to form a core region and one or more envelope regions at least partially surrounding said core region, thereby to fabricate an object being constructed from a plurality of layers and from a layered core constituting core regions and a layered shell constituting envelope regions,

wherein said circuit is further configured to (i) control said fabrication apparatus to ensure that said core and said shell are made from different modeling materials received from said supply apparatus or different combinations of modeling materials received from said supply apparatus, (ii) to control said fabrication apparatus to form, in at least one layer of said plurality of layers, a respective core region by dispensing both said first and said second modeling materials such that said materials occupy different spatial locations which are laterally displaced from each other and there are no vacant pixels, wherein an elementary displacement unit of each of said materials is a single pixel, and (iii) to control said fabrication apparatus to form, in said at least one layer, a respective envelope region by dispensing only said second material.

2. The computerized controller according to claim 1 , wherein a width of said envelope region is non-uniform across said layer.

3. The computerized controller according to claim 1 , being configured to operate the SFF system to dispense at least one of said first modeling material and said second modeling material to form at least one shell part parallel to said layers, wherein a material property characterizing said at least one shell part is different from a material property characterizing said core.

4. The computerized controller according to claim 3 , wherein said at least one shell part comprises at least one layer which is dispensed subsequently to any layer having said core region and said one or more envelope regions.

5. The computerized controller according to claim 3 , wherein said at least one shell part comprises at least one layer which is dispensed prior to any layer having said core region and said one or more envelope regions.

6. The computerized controller according to claim 3 , wherein said at least one shell part has a thickness which is less than a lateral width of said envelope.

7. The computerized controller according to claim 1 , wherein at least one of said core region and said envelope comprises said first and said second materials being interlaced over the respective region in a pixelated manner, and wherein for each of said first material and said second material, a relative surface density of said material in said core region is different from a relative surface density of said material in said envelope region.

8. The method of claim 1 , wherein said circuit is also configured to calculate a width of said envelope region separately for each layer, said width being defined within a plane engaged by said layer.

Assignments (2)
CHANGE OF NAME Recorded Feb 11, 2016
From: OBJET LTD.
To: STRATASYS LTD.
Reel/Frame 037781/0178 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2016
From: DIKOVSKY, DANIEL; LEVY, AVRAHAM; NAPADENSKY, EDUARDO
To: OBJET LTD.
Reel/Frame 037692/0777 →
Continuity (5)
Division 13642903
Provisional Application 61447743 · Mar 1, 2011
Provisional Application 61327693 · Apr 25, 2010
Provisional Application 61327692 · Apr 25, 2010
Related Publication 20160107383A1 · Apr 21, 2016