Semiconductor device, related manufacturing method, and related electronic device

1. A semiconductor device comprising:

a first doped region, which has a first dopant type;

a second doped region, which directly contacts the first doped region and has a second dopant type;

a third doped region, which directly contacts the first doped region and has the second dopant type;

a first dielectric layer, which directly contacts each of the first doped region, the second doped region, and the third doped region;

a first gate member, which is conductive and comprises a first gate portion, a second gate portion, and a third gate portion, wherein the first gate portion directly contacts the first dielectric layer and is positioned between the second doped region and the third doped region, wherein the second gate portion is positioned between the first gate portion and the third gate portion, and wherein a width of the second portion is unequal to a width of the third gate portion;

a doped portion, which is positioned between the third gate portion and the third doped region;

a second dielectric layer, which overlaps the third gate portion;

a second gate member, which is conductive and overlaps the second dielectric layer;

a source region, which is positioned at the second doped region; and

a drain region, which is positioned at the third doped region.

2. The semiconductor device of claim 1 , wherein the second gate portion partially overlaps the first gate portion without completely overlapping the first gate portion.

3. The semiconductor device of claim 1 , wherein the first gate member has the first dopant type, and wherein the doped portion has the first dopant type.

4. The semiconductor device of claim 1 , wherein a material of the doped portion is identical to a material of the first doped region.

5. The semiconductor device of claim 1 , wherein the doped portion directly contacts each of the third doped region, the second gate portion, and the third gate portion.

6. The semiconductor device of claim 1 , wherein the second dielectric layer directly contacts each of a side of the third gate portion and a side of the doped portion, and wherein the side of the third gate portion and the side of the doped portion are positioned on a same geometric plane.

7. The semiconductor device of claim 1 , wherein at least one of a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer is greater than or equal to 3.9.

8. The semiconductor device of claim 1 , wherein at least one of a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer is greater than or equal to 20.

9. The semiconductor device of claim 1 , wherein at least one of the first dielectric layer and the second dielectric layer is formed of at least one of silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, hafnium silicon oxide, hafnium silicon oxynitride, lanthanum oxide, zirconium oxide, zirconium silicon oxide, titanium oxide, tantalum oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, and aluminum oxide.

10. The semiconductor device of claim 1 comprising a spacer, wherein a portion of the second gate member is positioned between the spacer and the doped portion.

11. The semiconductor device of claim 1 , wherein a portion of the second dielectric layer directly contacts each of the doped portion and the portion of the second gate member and is positioned between the doped portion and the portion of the second gate member.

12. The semiconductor device of claim 1 , wherein a portion of the second dielectric layer directly contacts each of a portion of the first dielectric layer and a portion of the second gate member and is positioned between the portion of the first dielectric layer and the portion of the second gate member.

13. The semiconductor device of claim 1 , wherein the width of the second gate portion is less than the width of the third gate portion and is unequal to a width of the first gate portion.

14. An electronic device comprising:

an electronic component; and

a semiconductor device electrically connected to the electronic component and comprising:

a first doped region, which has a first dopant type;

a second doped region, which directly contacts the first doped region and has a second dopant type;

a third doped region, which directly contacts the first doped region and has the second dopant type;

a first dielectric layer, which directly contacts each of the first doped region, the second doped region, and the third doped region;

a first gate member, which is conductive and has the first dopant type and comprises a first gate portion, a second gate portion, and a third gate portion, wherein the first gate portion directly contacts the first dielectric layer and is positioned between the second doped region and the third doped region, wherein the second gate portion is positioned between the first gate portion and the third gate portion, and wherein a width of the second portion is unequal to a width of the third gate portion;

a doped portion, which is positioned between the third gate portion and the third doped region;

a second dielectric layer, which overlaps the third gate portion;

a second gate member, which overlaps the second dielectric layer;

a source region, which is positioned at the second doped region; and

a drain region, which is positioned at the third doped region.