Manufacturing method of semiconductor device
View Patent ↗In accordance with an embodiment, a manufacturing method of a semiconductor device includes forming, on a substrate, protruding portions with first films on the surfaces thereof, respectively, forming a second film different from the first films so as to fill a depressed portion between the protruding portions and to cover the protruding portions, processing in such a manner that the top surface of the second film on the depressed portion is higher than the top surface of the second film on the protruding portions after forming the second film to cover the protruding portions, and polishing the second film on the depressed and protruding portions to expose the first films.
1. A manufacturing method of a semiconductor device comprising:
forming, on a substrate, protruding portions comprising first films respectively provided on the surfaces thereof;
forming a second film different from the first films so as to fill a depressed portion between the protruding portions and to cover the protruding portions;
processing in such a manner that the top surface of the second film on the depressed portion is higher than the top surface of the second film on the protruding portions after forming the second film to cover the protruding portions; and
polishing the second film on the depressed and protruding portions to expose the first films,
wherein processing in such a manner that the top surface of the second film on the depressed portion is higher than the top surface of the second film on the protruding portions comprises:
covering the second film on the depressed portion and the protruding portions with a third film,
exposing the surface of the second film on the protruding portions after polishing the third film on the protruding portions,
polishing and removing the exposed second film on the protruding portions,
removing the third film covering the second film on the depressed portion after polishing and removing the exposed second film on the protruding portions, and
after removing the third film covering the second film on the depressed portion, exposing the first film on the protruding portion.
2. The method of claim 1 ,
wherein the second film is polished by use of a slurry containing an ammonium salt.
3. The method of claim 2 ,
wherein the third film comprises a SiN film, and the ammonium salt comprises polycarboxylic acid ammonium salt.
4. The method of claim 1 ,
wherein the third film is removed by use of a slurry containing no ammonium salt.
5. The method of claim 1 ,
wherein the third film comprises one of films selected from the group consisting of a silicon (Si) film, a silicon carbide (SiC) film, a carbon-doped silicon oxide (SiOC) film, a silicon oxynitride (SiON) film, and a silicon carbonitride (SiCN) film.
6. The method of claim 1 ,
wherein the second film comprises an SiO2 film.
7. The method of claim 1 ,
wherein a first slurry used in the polishing process of the third film on the protruding portions is different from a second slurry used in the polishing process of the exposed second film on the protruding portions.
8. The method of claim 1 ,
wherein a first slurry is used in the removing process of the third film covering the second film on the depressed portion, and
a second slurry is used in the removing process of the exposed second film on the protruding portions.
9. The method of claim 7 ,
wherein the first slurry is used in the removing process of the third film covering the second film on the depressed portion, and
the second slurry is used in the removing process of the exposed second film on the protruding portions.
10. The method of claim 1 ,
wherein the surface of the second film on the protruding portions is exposed by polishing the third film on the protruding portions, but not by pattering it.