Method for manufacturing optical engine packages and apparatus from which optical engine packages are manufactured

1. A method for manufacturing one or more optical engine packages, the method comprising:

receiving an apparatus comprising:

a substrate comprising a package portion and an adjacent cutting area;

a first optical engine package comprising an edge-aligned silicon photonic die having an edge-coupled waveguide, the optical engine package disposed on both the package portion and the adjacent cutting area such that the edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion;

a molding encapsulating the silicon photonic die and the substrate; and

cutting the apparatus, including the first optical engine package and the substrate, to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.

2. The method according to claim 1 , wherein cutting the apparatus, including the first optical engine package and the substrate, comprises cutting in the cutting area.

3. The method according to claim 1 , wherein cutting the apparatus, including the first optical engine package and the substrate, comprises cutting in the boundary.

4. The method according to claim 1 , further comprising polishing a surface of the exposed edge-coupled waveguide to facilitate light transmission between the edge-coupled waveguide and the optical fiber core.

5. The method according to claim 1 , further comprising aligning the optical fiber core with the exposed edge-coupled waveguide and securing the optical fiber core to the edge-coupled waveguide.

6. A method for manufacturing one or more optical engine packages, the method comprising:

receiving a substrate comprising a package portion and a cutting area adjacent to the package portion;

assembling a first optical engine package comprising a first silicon photonic die on the substrate such that a first edge-coupled waveguide of the first silicon photonic die is edge-aligned with and overlaps a boundary between the cutting area and the package portion;

a molding encapsulating the silicon photonic die and the substrate; and

cutting the substrate and the first optical engine package to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.

7. The method according to claim 6 , wherein cutting the substrate and the first optical engine package comprises cutting in the cutting area.

8. The method according to claim 6 , further comprising polishing a surface of the exposed edge-coupled waveguide to facilitate light transmission into the edge-coupled waveguide.

9. The method according to claim 6 , further comprising aligning the optical fiber core with the exposed edge-coupled waveguide, and attaching the optical fiber core to the exposed edge-coupled waveguide.

10. The method according to claim 6 , wherein the substrate further comprises at least one alignment marker for guiding assembly equipment to assemble the optical engine package on the substrate.

11. The method according to claim 10 , wherein assembling the optical engine package comprises placing the silicon photonic die on the substrate based on the at least one alignment marker.

12. The method according to claim 11 , wherein assembling the optical engine package further comprises placing a silicon electronic die on the substrate based on the at least one alignment marker.

13. The method according to claim 12 , wherein assembling the optical engine package further comprise attaching the silicon photonic die and the silicon electronic die to substrate.

14. The method according to claim 13 , wherein attaching comprises attaching the silicon photonic die and the silicon electronic die to the substrate utilizing curable epoxy.

15. The method according to claim 13 , wherein attaching comprises attaching the silicon photonic die and the silicon electronic die to the substrate utilizing a die attach film.

16. The method according to claim 13 , wherein assembling the optical engine package further comprises electrically interconnecting the silicon photonic die and the silicon electric die.

17. The method according to claim 16 , wherein electrically interconnecting comprises wirebonding the silicon photonic die and the silicon electronic die to the substrate.

18. The method according to claim 16 , wherein electrically interconnecting includes flip chip interconnecting the silicon photonic die and the silicon electronic die to the substrate.

19. The method according to claim 13 , wherein assembling the optical engine package further comprises molding the substrate with an epoxy molding compound.

20. The method according to claim 19 , wherein molding the substrate comprises encapsulating the substrate with a cap cured material.

21. The method according to claim 6 , wherein the cutting area is a first cutting area and the substrate comprises a second package portion and a second cutting area adjacent to the second package portion, and wherein the method further comprises:

assembling a second optical engine package comprising a second silicon photonic die on the substrate such that a second edge-coupled waveguide of the second silicon photonic die of the second optical engine package overlaps a second boundary between the second cutting area and the second package portion; and

cutting the substrate and the second optical engine package to expose the edge-coupled waveguide of the silicon photonic die of the second optical engine for optical coupling thereof to a second optical fiber core.

22. The method according to claim 21 , wherein cutting the substrate and the second optical engine package comprises cutting in the second cutting area.

23. The method according to claim 21 , wherein cutting the substrate and the first optical engine package comprises cutting in the first cutting area.