Switching circuit including wire traces to reduce the magnitude of voltage and current oscillations
A device includes an electrical circuit having one or more parallel layers and one or more electronic components of a switching circuit configured to operate at one or more frequencies mounted to several layers of the electrical circuit. Wire traces electrically connecting the one or more electronic components have cutouts with predetermined patterns and dimensions formed along edges where AC current flow is concentrated to increase an effective edge length of the wire traces to reduce oscillation and heat loss of the traces.
1. A device comprising:
an electrical circuit having one or more parallel layers;
at least two electronic components of a switching circuit configured to operate at one or more frequencies mounted to a first surface of an upper layer of the electrical circuit; and
wire traces configured to electrically connect the at least two electronic components having cutouts with predetermined patterns and dimensions formed along edges where AC current flow is concentrated to increase an effective edge length of the wire traces.
2. The device of claim 1 , wherein the at least two electronic components include semiconductor switches.
3. The device of claim 2 , wherein the semiconductor switches include silicon (Si), gallium nitride (GaN) or silicon carbide (SiC) switches.
4. The device of claim 1 , wherein switching transients produce second order current and voltage oscillations in the switching circuit when the at least two electronic components are turned on or off.
5. The device of claim 4 , wherein the cutouts formed along the edges of the wire traces increase a damping factor to reduce the current and voltage oscillations.
6. The device of claim 1 , wherein increasing the effective edge length of the wire traces increases an AC resistance of the switching circuit.
7. The device of claim 1 , wherein a depth of the cutouts is based on a switching frequency of the switching circuit.
8. The device of claim 7 , wherein the depth of the cutouts for the switching circuit increases as the switching frequency increases.
9. The device of claim 1 , wherein a distance between the cutouts is based on a switching frequency and a magnitude of transient oscillations.
10. The device of claim 1 , wherein the cutouts have a triangular, rounded, square, rectangular, or asymmetric/non-uniform shape.
11. The device of claim 1 , wherein a total width of the wire traces is greater than or equal to a skin depth of the AC current plus an average trace width.
12. The device of claim 11 , wherein a DC resistance of the wire traces is based on the average trace width.
13. A method comprising:
determining one or more physical and operational parameters for a switching circuit based on a schematic structure of the switching circuit, dimensions of an available area on a printed circuit board (PCB), and size of at least two electronic components of the switching circuit;
developing a circuit model for the switching circuit based on an equivalent inductance, capacitance, and resistance of the at least two electronic components of the switching circuit;
determining a design and layout for wire traces connecting the at least two electronic components of the switching circuit including patterns and dimensions of a plurality of cutouts formed along edges of the wire traces where AC current flow is concentrated; and
fabricating the PCB based on the design and layout determined.
14. The method of claim 13 , wherein the physical parameters for the switching circuit include at least one of a number, type, and size of the at least two electronic components, circuit structure, and dimensions of an area on the PCB for the switching circuit to be mounted.
15. The method of claim 13 , wherein the operational parameters for the switching circuit include at least one of an average switching frequency, current, operating voltage, and an operating temperature.
16. The method of claim 13 , wherein developing the circuit model for the switching circuit further comprises:
determining an inductance and resistance associated with the wire traces; and
determining a resistance and capacitance associated with the at least two electronic components of the switching circuit.
17. The method of claim 13 , wherein determining the design and layout for the wire traces further comprises:
determining the patterns and dimensions for the plurality of cutouts based on increasing an AC resistance of the wire traces and decreasing a DC resistance and inductance of the wire traces.
18. The method of claim 17 , wherein determining the layout for the wire traces further comprises:
determining a ratio of the DC resistance to the AC resistance for the switching circuit; and
designing the patterns and dimensions for the plurality of cutouts based on the ratio.
19. A device comprising:
a printed circuit board (PCB) having one or more parallel layers;
at least two electronic components of a switching circuit configured to operate at one or more frequencies mounted to a first surface of an upper layer of the PCB;
wire traces configured to electrically connect the at least two electronic components having cutouts with predetermined patterns and dimensions formed along edges where AC current flow is concentrated to increase an effective edge length of the wire traces; and
thermal traces mounted to a second surface of a lower layer of the PCB and connected to the at least two electronic components in parallel with the wire traces to extract heat from the switching circuit.
20. The device of claim 19 , wherein the thermal traces provide a secondary current path for the switching circuit.