IP Library Patent Application 14997108
Patent Application
App. No. 14/997,108

NANOSTRUCTURES HAVING LOW DEFECT DENSITY AND METHODS OF FORMING THEREOF

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Patent No.
US None
App. No.
14/997,108
Abstract

A method of forming nanostructure comprises forming self-assembled nucleic acids on at least a portion of a substrate. The method further comprises contacting the self-assembled nucleic acids on the at least a portion of a substrate with a solution comprising at least one repair enzyme to repair defects in the self-assembled nucleic acids. The method may comprise repeating the repair of defects in the self-assembled nucleic acids on the at least a portion of a substrate until a desired, reduced threshold level of defect density is achieved. A semiconductor structure comprises a pattern of self-assembled nucleic acids defining a template having at least one aperture therethrough. At least one of the apertures has a dimension of less than about 50 nm.

Claims (21)

1 . A semiconductor structure comprising a pattern of self-assembled nucleic acids defining a template having at least one aperture therethrough, the at least one aperture comprising at least one dimension of less than about 50 nm.

2 . The semiconductor structure of claim 1 , wherein the pattern of self-assembled nucleic acids comprise a pattern of self-assembled ribonucleic acid (RNA) strands, deoxyribonucleic acid (DNA) strands, peptide nucleic acid (PNA) strands, or combinations thereof.

3 . The semiconductor structure of claim 1 , wherein the at least one aperture in the pattern of self-assembled nucleic acids comprises at least one dimension of less than about 40 nm.

4 . The semiconductor structure of claim 1 , wherein the at least one aperture in the pattern of self-assembled nucleic acids comprises at least one dimension of less than about 30 nm.

5 . The semiconductor structure of claim 1 , wherein the at least one aperture in the pattern of self-assembled nucleic acids comprises at least one dimension of less than about 20 nm.

6 . The semiconductor structure of claim 1 , wherein the at least one aperture in the pattern of self-assembled nucleic acids comprises at least one dimension of less than about 10 nm.

7 . A semiconductor structure comprising a pattern of self-assembled nucleic acids on a substrate, the pattern of self-assembled nucleic acids comprising at least one aperture therethrough and the at least one aperture comprising at least one dimension of less than about 50 nm.

8 . The semiconductor structure of claim 7 , wherein the at least one aperture extends into the substrate.

9 . The semiconductor structure of claim 8 , further comprising a nanocomponent selected from the group consisting of a silicon nanowire, a gold nanoparticle, a semiconductive quantum dot, a fluorescent quantum dot, and combinations thereof in the at least one aperture.

10 . The semiconductor structure of claim 7 , wherein the substrate comprises gold, silver, silicon dioxide, or aluminum.

11 . The semiconductor structure of claim 7 , wherein the self-assembled nucleic acids comprise self-assembled multi-stranded nucleic acids, self-assembled scaffolded nucleic acids, self-assembled single-stranded nucleic acids, or combinations thereof.

12 . A semiconductor structure comprising:

a substrate comprising at least one feature having at least one feature dimension of less than about 50 nm, the at least one feature formed on the substrate by a process comprising:

forming a mask comprising a pattern of self-assembled nucleic acids on a substrate;

exposing the pattern of self-assembled nucleic acids on the substrate to at least one repair enzyme to repair defects in the self-assembled nucleic acids; and

forming the at least one feature on portions of the substrate exposed through the mask.

13 . The semiconductor structure of claim 12 , wherein the at least one feature dimension is less than about 40 nm.

14 . The semiconductor structure of claim 12 , wherein the at least one feature dimension is less than about 30 nm.

15 . The semiconductor structure of claim 12 , wherein the at least one feature dimension is less than about 20 nm.

16 . The semiconductor structure of claim 12 , wherein the at least one feature dimension is less than about 10 nm.

17 . The semiconductor structure of claim 12 , wherein the at least one feature comprises at least one of a silicon nanowire, a gold nanoparticle, a semiconductive quantum dot, or a fluorescent quantum dot.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →