IP Library Granted Patent US 9,915,700
Granted Patent B2
US 9,915,700 · App. 14/997,460 · Granted Mar 13, 2018

System and method for modulation mapping

Inventor: Steven Kasapi (San Francisco, CA)
Assignee: FEI EFA, Inc.
G01R31/311G01R31/2851G01R31/308
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Quick Facts
Patent No.
US 9,915,700
App. No.
14/997,460
Granted
Mar 13, 2018
Kind
B2
Abstract

Probing an integrated circuit (IC), by: electrically applying stimulation signal to said IC; scanning a selected area of said IC with a monochromatic beam; collecting beam reflection from the selected area of said IC, wherein the beam reflection correspond to modulation of the monochromatic beam by active devices of said IC; converting said beam reflection to an electrical probing signal; selecting a frequency or a band of frequencies of said probing signal; utilizing the probing signal to generate a spatial modulation map for various locations over the selected area of said IC; and displaying the spatial map on a monitor, wherein grey scale values correspond to modulation signal values.

Claims (34)

1. A method for probing an integrated circuit (IC), comprising:

electrically applying a stimulation signal to said IC;

scanning a selected area of said IC with a monochromatic beam;

collecting beam reflection from the selected area of said IC, wherein the beam reflection correspond to modulation of the monochromatic beam by active devices of said IC;

converting said beam reflection to an electrical probing signal;

selecting a frequency or a band of frequencies of said probing signal;

utilizing the selected frequency or band of frequencies of said probing signal to generate a spatial modulation map for various locations over the selected area of said IC; and

displaying the spatial map on a monitor, wherein grey scale values correspond to modulation signal values.

2. The method of claim 1 , wherein electrically applying stimulation signal comprises applying a square wave electrical signal.

3. The method of claim 2 , wherein the square wave signal electrical signal is applied in a periodic format at frequency Φ.

4. The method of claim 3 , further comprising inputting the electrical probing signal and a reference signal to a lock-in amplifier and multiplying the electrical probing signal with the reference signal.

5. The method of claim 4 , further comprising setting the reference signal to same frequency Φ but shifted by π/4.

6. The method of claim 1 , further comprising passing the beam reflection through a phase to amplitude converter prior to converting said beam reflection to an electrical probing signal.

7. The method of claim 6 , wherein converting said beam reflection to an electrical probing signal comprises applying the beam reflection to a photodetector after the beam reflection passes through the phase to amplitude converter, and further comprising amplifying an output of the photodetector by an RF amplifier.

8. The method of claim 1 , wherein the modulation signal values correspond to one of amplitude, intensity, polarization rotation, and phase of the beam reflection at each location within the selected area.

9. The method of claim 1 , further comprising multiplying said probing signal with a reference signal to thereby provide a product signal, and integrating said product signal to generate an integrated signal, and using the integrated signal to generate a spatial modulation map.

10. The method of claim 9 , wherein said reference signal is of frequency similar to that of said probing signal.

11. The method of claim 1 , wherein utilizing the probing signal comprises calculating total power at the selected frequency or band of frequencies, and said generating a spatial modulation map comprises generating a spatial map of total power for various locations over the selected area of said IC.

12. The method of claim 1 , wherein utilizing the probing signal comprises calculating intensity at the selected frequency or band of frequencies, and said generating a spatial modulation map comprises generating a spatial map of intensity for various locations over the selected area of said IC.

13. The method of claim 1 , wherein utilizing the probing signal comprises calculating phase at the selected frequency or band of frequencies, and said generating a spatial modulation map comprises generating a spatial map of phase for various locations over the selected area of said IC.

14. The method of claim 1 , wherein selecting a frequency comprises selecting frequency same as frequency Φ.

15. The method of claim 1 , further comprising generating an optical image of said selected area from said beam reflection.

16. The method of claim 1 , wherein said beam reflection comprises two orthogonal polarization states and further comprising retarding one of the polarization states and applying each of the two orthogonal states to separate photodetector.

17. The method of claim 16 , further comprising generating at least one of a summation or difference of the two orthogonal states.

18. The method of claim 16 , further comprising generating a ratio of the two orthogonal states.

19. The method of claim 1 , wherein generate a spatial modulation map comprises plotting a serious of modulation maps into a 3-D plot.

20. The method of claim 19 , further comprising generating cross-sections of the 3-D plot.

21. A method for probing an integrated circuit (IC), comprising:

electrically applying a stimulation signal to said IC;

scanning a selected area of said IC with a monochromatic beam;

collecting a beam reflection from the selected area of said IC, wherein the beam reflection corresponds to modulation of the monochromatic beam by active devices of said IC;

converting said beam reflection to an electrical probing signal;

utilizing the probing signal to generate a spatial modulation map for various locations over the selected area of said IC; and

displaying the spatial map on a monitor, wherein grey scale values correspond to modulation signal values.

Assignments (2)
CHANGE OF NAME Recorded May 31, 2017
From: DCG SYSTEMS, INC.
To: FEI EFA, INC.
Reel/Frame 042642/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2016
From: KASAPI, STEVEN
To: DCG SYSTEMS, INC.
Reel/Frame 037505/0331 →
Continuity (6)
Continuation 13657666 · Oct 22, 2012
Continuation 13095831 · Apr 27, 2011
Division 12534069 · Jul 31, 2009
Division 11438121 · May 18, 2006
Provisional Application 60711822 · Aug 26, 2005
Related Publication 20160131703A1 · May 12, 2016