High-conductivity bonding of metal nanowire arrays
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
1. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface, comprising the steps of:
removing a template membrane from the MNW array;
infiltrating the MNW array with a bonding material;
placing the bonding material on the adjacent surface;
bringing an adjacent surface into contact with a top surface of the MNW array while the bonding material is bondable; and
allowing the bonding material to form a solid bond between the MNW array and the adjacent surface.
2. The method of claim 1 , further comprising an additional step, performed after the placing step and before the bringing step, of:
wetting the bonding material to the adjacent surface.
3. The method of claim 1 , wherein the step of infiltrating comprises heating the bonding material so that it becomes one or more of softened and molten.
4. The method of claim 1 , wherein the step of infiltrating comprises chemically treating a composite material so as to create a bonding material.
5. The method of claim 1 , wherein the step of bringing comprises bringing the adjacent surface into contact with the top surface while the bonding material is one or more of softened and molten.
6. The method of claim 1 , wherein the bonding material comprises one or more of a fusible metal and an alloy.
7. The method of claim 1 , wherein the bonding material comprises one or more of tin and gold.
8. The method of claim 1 , wherein the step of bringing further comprises:
compressing one or more of the bonding material and the MNW array against the adjacent surface.
9. The method of claim 1 , wherein the infiltrating step further comprises wicking the bonding material into the interstitial volume of the MNW array.
10. The method of claim 9 , wherein the wicking is done by capillary forces.