IP Library › Granted Patent US 10,088,356
Granted Patent B2
US 10,088,356 · App. 15/007,217 · Granted Oct 2, 2018

Optical sensor

Inventors: Chang-Sheng Chu (Zhubei, TW); Yu-Tang Li (Zhubei, TW); Yeh-Wen Lee (Zhubei, TW); Chih-Hsun Fan (Zhubei, TW); Lung-Pin Chung (Zhubei, TW); Jyh-Chern Chen (Zhubei, TW); Shuang-Chao Chung (Zhubei, TW)
Assignee: Taiwan Biophotonic Corporation
G01J1/0459A61B5/14552A61B5/681G01J1/0271G01J1/0437G01J1/08G01J1/4228G01J1/44H01L31/0203H01L31/0232H01L31/02325H01L31/02327H01L31/125H01L31/173H01L33/54H01L33/58H04B10/071A61B2560/0443A61B2562/0233A61B2562/164A61B2562/227
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Quick Facts
Patent No.
US 10,088,356
App. No.
15/007,217
Granted
Oct 2, 2018
Kind
B2
Abstract

The present disclosure relates to an optical sensor module, an optical sensing accessory, and an optical sensing device. An optical sensor module comprises a light source, a photodetector, an electrode and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. The electrode is configured to detect an external circuit formed by the contact with an object surface. An optical sensing accessory and an optical sensing device comprise the optical sensor module and other electronic modules to have further applications.

Claims (29)

1. A dual sensor module comprising:

a substrate, comprising a first part and a second part;

a light source disposed on the substrate;

a first encapsulant formed over the light source;

a photodetector disposed on the substrate;

a second encapsulant formed over the photodetector; and

a first electrode electrically connected to the substrate,

wherein the light source, the first encapsulant, the photodetector, and the second encapsulant are disposed on the first part of the substrate, and the first electrode is disposed on the second part of the substrate.

2. The dual sensor module of claim 1 , wherein the first electrode is a thermocouple.

3. The dual sensor module of claim 1 , wherein the substrate is a detector circuit board.

4. The dual sensor module of claim 1 , wherein the first electrode is located between the light source and the photodetector.

5. The dual sensor module of claim 1 , further comprises a second electrode electrically connected to the substrate.

6. The dual sensor module of claim 5 , wherein the first electrode and the second electrode are configured to measure electrical potential difference.

7. The dual sensor module of claim 1 , further comprising a packaging wall coupled to the substrate and defining an area surrounding the light source and the photodetector.

8. The dual sensor module of claim 1 , further comprising a cover.

9. The dual sensor module of claim 8 , wherein the cover is configured with a curvature lens.

10. The dual sensor module of claim 8 , wherein the cover is configured with a microstructure.

11. The dual sensor module of claim 8 , wherein the cover is coated with an anti-scratch thin film, an anti-reflective thin film, or a filter thin film.

12. The dual sensor module of claim 1 , wherein the dual sensor module further comprises at least one of an analogue front end, a microcontroller, an operational amplifier, or a light source driver.

13. A dual sensing accessory for detecting optical and electrical properties comprising:

a dual sensor module of claim 1 ;

a communication module electrically connected to the dual sensor module; and

a housing containing the dual sensor module and the communication module.

14. A dual sensing device for detecting optical and electrical properties comprising:

a dual sensor module of claim 1 ;

a microprocessor electrically connected to the dual sensor module;

a memory electrically connected to the dual sensor module and the microprocessor;

a power supply electrically connected to the dual sensor module and the memory; and

a housing containing the dual sensor module, the microprocessor, the memory and the power supply.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2016
From: CHU, CHANG-SHENG; LI, YU-TANG; LEE, YEH-WEN; FAN, CHIH-HSUN; CHUNG, LUNG-PIN; CHEN, JYH-CHERN; CHUNG, SHUANG-CHAO
To: TAIWAN BIOPHOTONIC CORPORATION
Reel/Frame 037590/0712 →
Continuity (2)
Provisional Application 62115648 · Feb 13, 2015
Related Publication 20160238441A1 · Aug 18, 2016
Cited By (2)
US 12,436,102 US 12,642,460