Semiconductor device and method for fabricating the same
View Patent ↗A semiconductor device including a logic transistor, a non-volatile memory (NVM) cell and a contact etching stop layer (CESL) is shown. The CESL includes a first silicon nitride layer on the logic transistor but not on the NVM cell, a silicon oxide layer on the first silicon nitride layer and on the NVM cell, and a second silicon nitride layer disposed on the silicon oxide layer over the logic transistor and disposed on the silicon oxide layer on the NVM cell.
1. A semiconductor device, comprising:
a logic transistor;
a non-volatile memory (NVM) cell; and
a contact etching stop layer (CESL), comprising:
a first silicon nitride layer on the logic transistor but not on the NVM cell;
a silicon oxide layer on the first silicon nitride layer and on the NVM cell; and
a second silicon nitride layer disposed on the silicon oxide layer over the logic transistor and disposed on the silicon oxide layer on the NVM cell.
2. The semiconductor device of claim 1 , wherein the NVM cell comprises a single-poly non-volatile memory (SPNVM) cell.
3. The semiconductor device of claim 1 , wherein the NVM cell comprises a memory cell comprising a charge trapping layer.
4. The semiconductor device of claim 3 , wherein the charge trapping layer comprises a silicon nitride film.
5. The semiconductor device of claim 4 , wherein the memory cell comprising the charge trapping layer comprises a silicon/oxide/nitride/oxide/silicon (SONOS) cell.
6. The semiconductor device of claim 1 , wherein the NVM cell comprises a memory cell having a stack of a floating gate and a control gate.
7. The semiconductor device of claim 1 , further comprising a self-aligned silicide (salicide) layer formed on the logic transistor and the NVM cell, wherein the first silicon nitride layer is also on the salicide layer formed on the logic transistor, and the silicon oxide layer is also on the salicide layer formed on the NVM cell.