Multilayer ceramic electronic component and method of manufacturing the same

1. A multilayer ceramic electronic component comprising:

a ceramic body including an electrode structure including internal electrodes stacked to face each other with respective dielectric layers interposed therebetween and alternately exposed to first and second end surfaces thereof and ceramic bands enclosing regions spaced apart from the first and second end surfaces of the electrode structure; and

external electrodes spaced apart from the ceramic band and covering the first and second end surfaces of the electrode structure and at least portions of surfaces of the electrode structure connected to the first and second end surfaces of the electrode structure, respectively,

wherein when a thickness direction refers to a stacking direction of the internal electrodes, the external electrodes have a thickness less than that of the ceramic body in the thickness direction.

2. The multilayer ceramic electronic component of claim 1 , wherein when a width direction refers to a direction perpendicular to both of a stacking direction of the internal electrodes and a length direction, the external electrodes have a width narrower than that of the ceramic body in the width direction.

3. The multilayer ceramic electronic component of claim 1 , wherein the external electrodes cover an entirety of the surfaces of the electrode structure connected to the first and second end surfaces of the electrode structure.

4. The multilayer ceramic electronic component of claim 1 , wherein the ceramic body has an overlap region in which the internal electrodes adjacent to each other in an exposed direction of the internal electrodes overlap each other and margin regions formed at both ends of the overlap region, and

the margin regions are formed in regions between the first and second end surfaces of the electrode structure and the ceramic bands in the ceramic body.

5. The multilayer ceramic electronic component of claim 1 , wherein the ceramic body has an overlap region in which the internal electrodes adjacent to each other in an exposed direction of the internal electrodes overlap each other and margin regions formed at both ends of the overlap region, and

the margin regions are formed from the first and second end surfaces of the electrode structure and include portions of regions in which the ceramic bands are formed in the ceramic body.

6. The multilayer ceramic electronic component of claim 1 , wherein the internal electrodes are exposed to first and second surfaces of the electrode structure connected to the first and second end surfaces of the electrode structure.

7. The multilayer ceramic electronic component of claim 1 , wherein C<D, where C is a length of the extent of the external electrode along an upper surface of the electrode structure and D is a distance between the end surface of the electrode structure and the ceramic band.

8. A method of manufacturing a multilayer ceramic electronic component, comprising steps of:

preparing a ceramic body including an electrode structure including internal electrodes stacked to face each other with respective dielectric layers interposed therebetween and alternately exposed to first and second end surfaces thereof and ceramic bands enclosing regions spaced apart from the first and second end surfaces of the electrode structure; and

forming external electrodes spaced apart from the ceramic band and covering the first and second end surfaces of the electrode structure and at least portions of surfaces of the electrode structure connected to the first and second end surfaces of the electrode structure, respectively,

wherein when a thickness direction refers to a stacking direction of the internal electrodes, the external electrodes have a thickness less than that of the ceramic body in the thickness direction.

9. The method of claim 8 , wherein when a width direction refers to a direction perpendicular to both of a stacking direction of the internal electrodes and a length direction, the external electrodes have a width narrower than that of the ceramic body in the width direction.

10. The method of claim 8 , wherein the external electrodes cover the entirety of the surfaces of the electrode structure connected to the first and second end surfaces of the electrode structure.

11. The method of claim 8 , wherein in the step of forming the external electrodes, an applying method or a plating method is used.

12. The method of claim 8 , wherein the ceramic body has an overlap region in which the internal electrodes adjacent to each other in an exposed direction of the internal electrodes overlap each other and margin regions formed at both ends of the overlap region, and

the margin regions are formed in regions between the first and second end surfaces of the electrode structure and the ceramic bands in the ceramic body.

13. The method of claim 8 , wherein the ceramic body has an overlap region in which the internal electrodes adjacent to each other in an exposed direction of the internal electrodes overlap each other and margin regions formed at both ends of the overlap region, and

the margin regions are formed from the first and second end surfaces of the electrode structure and include portions of regions in which the ceramic bands are formed in the ceramic body.

14. The method of claim 8 , wherein the internal electrodes are exposed to first and second surfaces of the electrode structure connected to the first and second end surfaces of the electrode structure.

15. The method of claim 8 , wherein C<D, where C is a length of the extent of the external electrode along an upper surface of the electrode structure and D is a distance between the end surface of the electrode structure and the ceramic band.