Implantable vessel fluid sensor

1. An implantable vessel fluid sensor configured to sense at least one vessel fluid parameter of a vessel, the implantable vessel fluid sensor comprising:

a tubular body including a first end portion and a second end portion and forming an open channel between the first end portion and the second end portion, the first end portion being configured to be inserted into and to form a sealed junction with a first open vessel end of the vessel, the second end portion being configured to be inserted into and to form a sealed junction with a second open vessel end of the vessel to form an artificial vessel part interconnecting the first open vessel end and the second open vessel end of the vessel; and

a semiconductor sensor unit connected to the open channel of the tubular body and comprising a semiconductor sensor region configured to be in direct contact with a vessel fluid in a sealed junction state.

2. The implantable vessel fluid sensor of claim 1 , wherein the semiconductor sensor region of the semiconductor sensor unit is inserted in a cut or an opening of the tubular body, and wherein the cut or the opening is sealed by a sealing structure.

3. The implantable vessel fluid sensor of claim 1 , wherein the tubular body includes a T-tube having the first end portion and the second end portion, and further having a sensor end portion for accommodating the semiconductor sensor unit, the sensor end portion having a blind end.

4. The implantable vessel fluid sensor of claim 1 , wherein the tubular body is attached to the semiconductor sensor unit and has a sensor opening at the semiconductor sensor region of the semiconductor sensor unit, the area of the attached tubular body being smaller than the area of the semiconductor sensor unit facing the tubular body.

5. The implantable vessel fluid sensor of claim 1 , wherein the tubular body comprises a first part having a first cross-sectional area and a second part having a second cross-sectional area, the second cross-sectional area being different than the first cross-sectional area, and wherein the semiconductor sensor unit comprises a first semiconductor sensor region configured to sense fluid pressure at the first part and a second semiconductor sensor region configured to sense the fluid pressure at the second part.

6. A method of implanting an implantable vessel fluid sensor, the method comprising:

providing an implantable vessel fluid sensor configured to sense at least one vessel fluid parameter of a vessel, the implantable vessel fluid sensor comprising: a tubular body including a first end portion, the first end portion being configured to be inserted into and to form a sealed junction with an open vessel end of the vessel; and a sensor unit connected to the tubular body and comprising a sensor region configured to be in direct contact with a vessel fluid in a sealed junction state, wherein a minimum distance between the sensor region and the first end portion is at most 10 times an outer diameter of the first end portion of the tubular body, and wherein the sensor unit is a semiconductor device comprising: a proximal part plugging the first end portion of the tubular body and having an interconnection side; and a distal part protruding from the first end portion of the tubular body and having a sensor side

cutting a vessel into two parts, the two parts having an open vessel end and a remaining open vessel end, respectively;

inserting the first end portion of the tubular body into the open vessel end; and

forming a sealed junction between the first end portion and the open vessel end.