Debris removal from high aspect structures

1. A system configured to remove debris from a surface of a substrate, comprising:

an image recognition system to identify the debris to be removed;

a cantilever arm;

a tip having a proximal portion and a distal portion, the tip being supported by the cantilever arm at the proximal portion of the tip,

wherein a plurality of nanofibrils extend from the distal portion of the tip, one or more of the nanofibrils being configured to elastically deform against or around the debris or the surface of the substrate and further configured to mechanically entangle particles,

wherein at least one of the nanofibrils is a wrap fibril having a yield stress of less than 0.5 GPa,

wherein the wrap fibril is configured to coil around and entangle of coiling around and entangling the debris, and mechanically dislodge the debris, and

a material in which the removed debris is deposited.

2. The system of claim 1 , wherein the system is further configured to remove the debris from a nanomachined surface of the substrate.

3. The system of claim 1 , wherein the system is further configured to remove the debris from a surface of a photolithography mask or a semiconductor substrate/wafer.

4. The system of claim 1 , wherein the system is further configured to remove the debris from a surface of a membrane, pellicle film, a micro-electronic mechanical system (MEMS), or a nano-electronic mechanical system (NEMS).

5. The system of claim 1 , wherein at least one of the nanobrils is a stiff fibril and has a yield stress of greater than or equal to 0.5 GPa.

6. The system of claim 1 , wherein the wrap fibril is made of one or more of deoxyribonucleic acid, ribonucleic acid, actin, amyloid nanostructures, and ionomers.

7. The system of claim 1 , wherein the wrap fibril is formed by immersing at least a portion of the tip in an aqueous solution, or placing at least the portion of the tip in contact with a surface containing deoxyribonucleic acid.

8. The system of claim 1 , wherein the debris wherein the debris comprises a plurality of nanoparticles.

9. The system of claim 1 , wherein the nanofibrils include at least two stiff fibrils, the at least two stiff fibrils being attached to the tip such that the two stiff fibril are spaced apart at a distance less than a diameter of the debris.

10. The system of claim 9 , wherein the at least two stiff fibrils have a yield stress of greater than or equal to 0.5 GPa.

11. The system of claim 10 , wherein the at least two stiff fibrils have unequal lengths.

12. The system of claim 1 , wherein the nanofibrils include at least two wrap fibrils, the at least two wrap fibrils being configured to wrap around at least one nanoparticle.

13. The system of claim 12 , wherein the at least two wrap fibrils have a yield stress of less than 0.5 GPa.

14. The system of claim 1 , wherein the tip is coated with molecular tweezers, the molecular tweezers comprising noncyclic compounds with open cavities configured to bind the debris.

15. The system of claim 14 , wherein the coated tip is configured to bind the debris via one or more of non-covalent bonding, metal coordination, hydrophobic forces, van der Waals forces, 7C-7C interactions, and electrostatic effects.

16. The system of claim 1 , wherein the nanofibrils comprise a combination of both stiff and wrap fibrils.

17. The system of claim 1 , wherein the surface of the tip includes a dielectric surface.

18. The system of claim 1 , wherein the tip comprises diamond.

19. The system of claim 1 , wherein the tip comprises a polytetrafluoroethylene coating.