IP Library Granted Patent US 9,743,051
Granted Patent B2
US 9,743,051 · App. 15/012,044 · Granted Aug 22, 2017

Thin form factor computational array cameras and modular array cameras

Inventors: Kartik Venkataraman (San Jose, CA); Paul Gallagher (San Jose, CA); Dan Lelescu (Morgan Hill, CA); Andrew Kenneth John McMahon (San Carlos, CA); Jacques Duparre (Jena, DE); Bedabrata Pain (Los Angeles, CA)
Assignee: FotoNation Cayman Limited
H04N9/09H04N5/2252H04N5/2254H04N5/23232H04N5/247H04N5/332H04N5/349H04N5/3692H04N5/378
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Quick Facts
Patent No.
US 9,743,051
App. No.
15/012,044
Granted
Aug 22, 2017
Kind
B2
Abstract

Systems and methods in accordance with embodiments of the invention implement modular array cameras using sub-array modules. In one embodiment, an X×Y sub-array module includes: an X×Y arrangement of focal planes, where X and Y are each greater than or equal to 1; and an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the X×Y sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed.

Claims (38)

1. An X×Y sub-array module comprising:

an X×Y arrangement of focal planes, wherein:

X and Y are each greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and

each focal plane does not include pixels from another focal plane; and

an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data input circuitry that is capable of receiving image data from a separate sub-array module; and

image data output circuitry that is capable of aggregating image data from the X×Y sub-array module with image data received via the image data input circuitry from a separate sub-array module.

2. The X×Y sub-array module of claim 1 , wherein X is 1.

3. The X×Y sub-array module of claim 1 , wherein X and Y are each greater than 1.

4. The X×Y sub-array module of claim 1 , wherein the arrangement of cameras are embodied within a single monolithic structure.

5. An M×N array camera comprising:

a plurality of X×Y sub-array modules, each comprising:

an X×Y arrangement of focal planes, wherein:

X and Y are each greater than or equal to 1;

each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and

each focal plane does not include pixels from another focal plane; and

an X×Y arrangement of lens stacks, the X×Y arrangement of lens stacks being disposed relative to the X×Y arrangement of focal planes so as to form an X×Y arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene;

image data input circuitry that is capable of receiving image data from a separate sub-array module; and

image data output circuitry that is capable of aggregating image data from the sub-array module with image data received via the image data input circuitry from a separate sub-array module;

wherein the plurality of X×Y sub-array modules define at least some of the cameras in an M×N arrangement of cameras; and

a processor;

wherein the processor is configured to construct an image of the scene using image data generated by each of the sub-array modules.

6. The array camera of claim 5 , wherein X is 1 and M is 1.

7. The array camera of claim 5 , wherein the plurality of X×Y sub-array modules define an M×N arrangement of cameras.

8. The array camera of claim 5 , further comprising circuitry that aggregates the image data generated by each of the sub-array modules into a single MIPI output, and provides the MIPI output to the processor.

9. The array camera of claim 5 , further comprising a parallax disparity resolution module, wherein the parallax disparity resolution module is configured to receive image data captured by each sub-array module, implement a parallax detection and correction process on the received image data, and output the result for further processing.

10. The array camera of claim 9 , further comprising circuitry that converts the output of the parallax disparity resolution module into a single MIPI output, and provides the MIPI output to the processor.

11. The array camera of claim 10 , wherein the parallax disparity resolution module comprises a processor and memory, wherein the memory contains software to configure the processor to act as a parallax disparity resolution module.

12. The array camera of claim 10 , wherein the parallax disparity resolution module is a hardware parallax disparity resolution module.

13. The array camera of claim 5 , wherein M and N are each greater than or equal to 2.

14. The array camera of claim 5 , wherein at least two of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and are each capable of outputting image data through the interconnects.

15. The array camera of claim 14 , wherein each of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and are each capable of outputting image data through the interconnects.

16. The array camera of claim 15 , wherein the substrate is optically transparent.

17. The array camera of claim 16 , wherein the substrate is glass.

18. The array camera of claim 15 , wherein the substrate is ceramic with through-holes that clear the optical path.

19. The array camera of claim 5 , wherein at least one sub-array module is embodied within a single monolithic structure.

20. The array camera of claim 5 , wherein each sub-array module is embodied within a single respective monolithic structure.

Assignments (5)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2018
From: FOTONATION CAYMAN LIMITED
To: FOTONATION LIMITED
Reel/Frame 046539/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: KIP PELI P1 LP
To: PELICAN IMAGING CORPORATION
Reel/Frame 040674/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: PELICAN IMAGING CORPORATION
To: FOTONATION CAYMAN LIMITED
Reel/Frame 040675/0025 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2016
From: VENKATARAMAN, KARTIK; GALLAGHER, PAUL; LELESCU, DAN; MCMAHON, ANDREW KENNETH JOHN; DUPARRE, JACQUES; PAIN, BEDABRATA
To: PELICAN IMAGING CORPORATION
Reel/Frame 039913/0155 →
Continuity (3)
Continuation 14188524 · Feb 24, 2014
Provisional Application 61768523 · Feb 24, 2013
Related Publication 20160269651A1 · Sep 15, 2016