Manufacturing method and manufacturing device for integrally forming waterproof structure for 3C electronic product

1. A manufacturing device for integrally forming a waterproof structure for a 3C electronic product, comprising:

a mold comprising an upper mold part and a lower mold part; and

an ejection mechanism provided in the lower mold part,

wherein a product cavity for placing a product and a waterproof structure cavity connected to the product cavity and configured to form a waterproof structure on the product are formed when the upper mold part and the lower mold part are joined,

wherein the upper mold part is opened with a solid silicone raw material sprue,

wherein the sprue is in communication with the waterproof structure cavity through a silicone inlet channel,

wherein the mold is provided with a material pressing device matching the sprue,

wherein the material pressing device is configured to extrude a solid silicone raw material in the sprue, so that the solid silicone raw material flows into the waterproof structure cavity through the silicone inlet channel,

wherein the ejection mechanism is configured to eject upward, from the lower mold part, a product upon which the silicone waterproof structure is formed,

wherein the ejection mechanism comprises a lower mold insert mounted in the lower mold part, an ejector sleeved in the lower mold insert in a piston manner, and an ejector pin mounted at a lower end of the ejector and configured to apply an ejection force,

wherein the waterproof structure cavity is located at an outer side of the lower mold insert,

wherein the tops of the lower mold insert and the ejector support a product, and

wherein when the ejector performs upward ejection from the lower mold insert, the product is separated from the lower mold insert and the lower mold part.

2. A method of using the manufacturing device of claim 1 to integrally form a waterproof structure for a 3C electronic product, comprising the following steps:

a. feeding a predetermined amount of a solid silicone raw material into a sprue;

b. extruding the solid silicone raw material in the sprue, so that the solid silicone raw material flows into, through a silicone inlet channel, a waterproof structure cavity in the mold in which a product is placed; and

c. heating the solid silicone with a high temperature in the mold to have a vulcanization reaction, and finally to integrally form a silicone waterproof structure on the product.

3. The method according to claim 2 , further comprising the following step after step c:

d. separating an upper mold part of the mold upwardly from a lower mold part for supporting the product, and ejecting the product with the silicone waterproof structure upward from the lower mold part by using an ejection mechanism provided in the lower mold part.

4. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 1 , wherein the upper mold part comprises an upper plate and a middle plate below the upper plate; the sprue is opened at the top of the middle plate; the material pressing device comprises a material pressing column provided at the bottom of the upper plate; the upper plate and the middle plate can be joined or separated; and when the upper plate and the middle plate are joined, the material pressing column is pressed into the sprue.

5. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 1 , wherein the waterproof structure cavity is located below the product cavity; the silicone inlet channel comprises an upper mold channel located in the upper mold part and a lower mold channel located in the lower mold part; the upper mold channel extends from top to bottom, so as to be connected to the lower mold channel; at least a part of the lower mold channel extends to a position below the product cavity, and further extends from bottom to top so as to be in communication with the waterproof structure cavity.

6. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 5 , wherein the upper mold channel substantially extends vertically to a position below a horizontal position of the product cavity; and the channel formed on the silicone inlet insert and a part of the lower mold channel that is in communication with the channel formed on the silicone inlet insert substantially extend horizontally.

7. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 1 , further comprising: a reset mechanism provided in the lower mold part, wherein the reset mechanism comprises a return pin that is arranged in a manner of being linked with the ejector, being capable of ejecting upward from the lower mold part with the ejector, and being capable of carrying the ejector back to an original position, and an elastic member configured to apply a reset force to the return pin; and the elastic member is used to withstand a position change of the return pin.

8. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 1 , further comprising: a mold-opening pulling mechanism, wherein the mold-opening pulling mechanism comprises pulling pins respectively coupled to the upper mold part and the ejector from an upper part and a lower part; the pulling pins are arranged in a manner of being linked with the ejector, so as to pull, when the upper mold part is opened, the ejector to eject upward from the lower mold part.

9. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 5 , wherein a silicone inlet insert is further provided between the upper mold part and the lower mold part, and the upper mold channel is connected to the lower mold channel through a channel formed on the silicone inlet insert.

10. The manufacturing device for integrally forming a waterproof structure for a 3C electronic product according to claim 8 , wherein the pulling pins move upward with the upper mold part by using a resin shutter partially embedded in the upper mold part; a lower end of the resin shutter is screwed to the pulling pins with openings in upper ends; and an upper end of the resin shutter is tightly embedded into a mounting hole opened in the upper mold part.