Semiconductor light emitting device
Disclosed is a semiconductor light emitting device, including: a body, which has a bottom part with at least one hole formed therein, a side wall, and a cavity defined by the bottom part and the side wall; a semiconductor light emitting chip, which is placed in each hole and includes plural semiconductor layers adapted to generate light by electron-hole recombination and electrodes electrically connected to the plural semiconductor layers; and an encapsulating member provided at least to the cavity to cover the semiconductor light emitting chip, in which the electrodes of the semiconductor light emitting chip are exposed towards the lower face of the bottom part of the body.
1. A semiconductor light emitting device, comprising:
a body, which has a bottom part with at least one hole formed therein, a side wall, and a cavity defined by the bottom part and the side wall,
a semiconductor light emitting chip, which is placed in each hole and includes plural semiconductor layers adapted to generate light by electron-hole recombination and electrodes electrically connected to the plural semiconductor layers, wherein the semiconductor light emitting chip has a height; and
an encapsulating member provided at least to the cavity to cover the semiconductor light emitting chip,
wherein the electrodes of the semiconductor light emitting chip are exposed towards the lower face of the bottom part of the body,
wherein the bottom part has a length, an upper face, a lower face, and a height, the height of the bottom part measured with respect to the lower face of the bottom part, at each hole the bottom part has a lateral part extending from the lower face to the upper face to define the hole, the lateral part faces the plural semiconductor layers of the semiconductor light emitting chip, and the lateral part is spaced from the semiconductor light emitting chip placed in the hole,
wherein the side wall has a height greater than the height of the bottom part and has an outer face and an inner face, and the cavity is defined by the inner face of the side wall and the upper face of the bottom part; and
wherein each hole formed in the bottom part is larger than the semiconductor light emitting chip so that the encapsulating member is filled within each hole between the bottom part and the semiconductor light emitting chip.
2. The semiconductor light emitting device of claim 1 , wherein a reflecting layer is formed at least one of inner faces of the side wall of the body and the upper face of the bottom part of the body.
3. The semiconductor light emitting device of claim 2 , wherein the reflecting layer is formed all over the upper face of the bottom part.
4. The semiconductor light emitting device of claim 3 , wherein the reflecting layer is a metallic layer.
5. The semiconductor light emitting device of claim 1 , wherein the bottom part is formed at a lower height level than the semiconductor light emitting chip.
6. The semiconductor light emitting device of claim 1 , wherein a reflective substance is arranged between the bottom part and the semiconductor light emitting chip.
7. The semiconductor light emitting device of claim 6 , wherein the reflective substance is a white reflective resin.
8. The semiconductor light emitting device of claim 1 , further comprising:
a bonding part located on the lower face of the bottom part of the body, while keeping a distance from the electrodes of the semiconductor light emitting chip that is exposed towards the lower face of the bottom part of the body.
9. The semiconductor light emitting device of claim 8 , wherein the bonding part is made of a metal.
10. The semiconductor light emitting device of claim 1 , wherein plural holes are formed, semiconductor light emitting chips are placed in the holes respectively and the semiconductor light emitting device further comprises a metallic bonding part located on the lower face of the bottom part of the body, while keeping a distance from the electrodes of the semiconductor light emitting chip that is exposed towards the lower face of the bottom part of the body.
11. The semiconductor light emitting device of claim 10 , wherein the semiconductor light emitting chips placed in their respective holes emit lights having different colors.
12. The semiconductor light emitting device of claim 1 , wherein the encapsulating member serves to fix the semiconductor light emitting chip placed in each hole to the body.
13. The semiconductor light emitting device of claim 1 , wherein the side wall has a height greater than length of the bottom part.
14. The semiconductor light emitting device of claim 1 , wherein plural holes are formed, and barriers are arranged between the holes.
15. The semiconductor light emitting device of claim 1 , wherein the hole has slanted lateral faces.
16. The semiconductor light emitting device of claim 1 , wherein the body has a protruded portion; and the semiconductor light emitting device further comprises a lens formed on the encapsulating member and between the protruded parts.