IP Library Granted Patent US 11,004,674
Granted Patent B2
US 11,004,674 · App. 15/023,161 · Granted May 11, 2021

Substrate treatment method and substrate treatment equipment

Inventors: Daisaku Yano (Tokyo, JP); Yukinari Yamashita (Tokyo, JP); Masami Murayama (Tokyo, JP); Koji Yamanaka (Tokyo, JP)
Assignee: ORGANO CORPORATION
H01L21/02068C02F9/00C23G1/24C23G5/00H01L21/02071H01L21/6708H01L21/67017H01L21/67051H01L21/67086C02F1/20
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Quick Facts
Patent No.
US 11,004,674
App. No.
15/023,161
Granted
May 11, 2021
Kind
B2
Abstract

Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.

Claims (27)

1. A substrate treatment equipment comprising:

a plurality of treatment chambers in each of which a substrate is to be disposed and to each of which a substrate treatment solution for treating the substrate is to be supplied;

an inert gas filling mechanism configured to fill an inert gas in each of the treatment chambers;

a main pipe having an upstream end connected to an ultrapure water circulation pipe of a subsystem of an ultrapure water production equipment, the subsystem including a non-regenerative ion-exchange equipment;

a plurality of treatment solution supply pipes each having an upstream end connected to the main pipe and a downstream end connected to each of the plurality of treatment chambers; and

a catalytic unit provided on each of the treatment solution supply pipes or in each of the treatment chambers, and filled with a platinum-group metal catalyst through which a hydrogen-dissolved solution prepared by adding hydrogen to ultrapure water is to be passed, the platinum-group metal catalyst being obtained as a result of supporting a palladium catalyst on a monolithic organic porous anion exchanger,

wherein a hydrogen-dissolved treatment solution obtained by passing the hydrogen-dissolved solution through the platinum-group metal catalyst is supplied as the substrate treatment solution into each of the treatment chambers.

2. The substrate treatment equipment according to claim 1 , wherein each of the treatment chambers is provided with a substrate holding mechanism configured to hold at least the substrate and a treatment solution nozzle configured to supply the substrate treatment solution to the substrate held by the substrate holding mechanism.

3. The substrate treatment equipment according to claim 2 , comprising a shield member having a substrate facing surface facing the substrate held by the substrate holding mechanism,

wherein the treatment solution nozzle and the inert gas filling mechanism are provided for the shield member, so that the substrate treatment solution and the inert gas can be supplied to a space between the substrate held by the substrate holding mechanism and the substrate facing surface of the shield member.

4. The substrate treatment equipment according to claim 1 , wherein each of the treatment chambers is provided with a treatment tank in which at least the substrate is disposed and a treatment solution nozzle configured to supply the substrate treatment solution into the treatment tank.

5. The substrate treatment equipment according to claim 1 , wherein a pipe configured to supply the substrate treatment solution into each of the treatment chambers comprises an inner pipe through which the substrate treatment solution passes and an outer pipe configured to surround the inner pipe, and

further comprising a unit configured to supply the inert gas to a space between the inner pipe and the outer pipe.

6. The substrate treatment equipment according to claim 1 , further comprising a chemical solution preparation unit configured to prepare a dilute chemical solution by injecting a chemical solution into a pipe configured to supply the substrate treatment solution into each of the treatment chambers and mixing the chemical solution and the substrate treatment solution in the pipe.

7. The substrate treatment equipment according to claim 6 , further comprising a chemical solution tank configured to store therein the chemical solution and a unit configured to supply the inert gas into the chemical solution tank.

8. The substrate treatment equipment according to claim 1 , comprising a chemical solution dilution tank into which a chemical solution and the substrate treatment solution are supplied to dilute the substrate treatment solution with the chemical solution, and configured to supply a dilute chemical solution obtained by diluting the substrate treatment solution with the chemical solution into each of the treatment chambers.

9. The substrate treatment equipment according to claim 8 , further comprising a unit configured to supply the inert gas into the chemical solution dilution tank.

10. The substrate treatment equipment according to claim 8 , wherein a pipe configured to supply the dilute chemical solution into each of the treatment chambers comprises an inner pipe through which the dilute chemical solution passes and an outer pipe configured to surround the inner pipe, and

further comprising a unit configured to supply the inert gas to a space between the inner pipe and the outer pipe.

11. The substrate treatment equipment according to claim 1 , wherein the substrate that is to be treated by the substrate treatment solution is a substrate of which a single body of any one element or a compound of at least copper, molybdenum and tungsten is exposed on a surface thereof.

12. A catalytic unit being disposed on each of the treatment solution supply pipes or in each of the treatment chambers of the substrate treatment equipment according to claim 1 and having a platinum-group metal catalyst filled therein, the platinum-group metal catalyst being obtained as a result of supporting a palladium catalyst on a monolithic organic porous anion exchanger, wherein a hydrogen-dissolved treatment solution obtained by passing a hydrogen-dissolved solution through the platinum-group metal catalyst is supplied as a substrate treatment solution into each of the treatment chambers.

13. The substrate treatment equipment according to claim 1 , wherein a concentration of dissolved hydrogen in the hydrogen-dissolved solution is 8 μg/L or higher,

wherein the inert gas filling mechanism is configured to fill each of the treatment chambers with the inert gas so that a concentration of oxygen gas in each of the treatment chambers is 2% or less, and

wherein the catalytic unit is configured to adjust a concentration of dissolved oxygen to 2 μg/L or less and a concentration of hydrogen peroxide to 2 μg/L or less in the hydrogen-dissolved treatment solution.

14. The substrate treatment equipment according to claim 1 , wherein the substrate treatment equipment is configured to determine whether or not a concentration of dissolved hydrogen in the hydrogen-dissolved solution is determined to be be 8 μg/L or higher at a position just before the catalytic unit.

15. The substrate treatment equipment according to claim 1 , wherein all components of the non-regenerative ion-exchange equipment are located upstream of the upstream end of the main pipe.

16. The substrate treatment equipment according to claim 1 , wherein each respective catalytic unit is located inside each respective treatment chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2016
From: YANO, DAISAKU; YAMASHITA, YUKINARI; MURAYAMA, MASAMI; YAMANAKA, KOJI
To: ORGANO CORPORATION
Reel/Frame 038033/0055 →
Priority Claims (4)
JP JP2013-198535 · Sep 25, 2013 · national
JP JP2013-198549 · Sep 25, 2013 · national
JP JP2013-206447 · Oct 1, 2013 · national
JP JP2014-097459 · May 9, 2014 · national
Continuity (1)
Related Publication 20160233082A1 · Aug 11, 2016