IP Library › Granted Patent US 10,031,030
Granted Patent B2
US 10,031,030 · App. 15/023,735 · Granted Jul 24, 2018

Temperature sensor arrangement with an electrically and thermally insulating covering

Inventors: Matthias Keuten (Altdorf, DE); Andreas Voegerl (Parsberg, DE); Juergen Henniger (Erlanfen-Dechsendorf, DE); Matthias Wieczorek (Neunkirchen am Sand, DE); Lisa-Maria Wittmann (Alesheim, DE)
Assignee: Conti Temic microelectronic GmbH
G01K7/22G01K1/08G01K1/16G01K2205/00
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Quick Facts
Patent No.
US 10,031,030
App. No.
15/023,735
Granted
Jul 24, 2018
Kind
B2
Abstract

A sensor configuration measures the temperature of a medium in a vehicle. The sensor configuration includes a sensor body and two connecting wires and is completely insulated from the medium. The sensor body is electrically and thermally insulated from the medium by a covering completely surrounding the sensor body and is in heat-conducting contact with the medium substantially through the connecting wires.

Claims (14)

1. A sensor configuration, comprising:

a sensor body and two connection wires, for measuring a temperature of a medium in a motor vehicle, said sensor body being in thermally conductive contact with the medium through said connection wires;

a covering completely surrounding said sensor body and electrically and thermally insulating said sensor body from the medium;

a contact base from which a sensor signal can be tapped off; and

separate connection contacts each electrically conductively connecting a respective one of said connection wires to said contact base, at least one part of at least one of said connection contacts having a contact surface to be exposed to the medium, said contact surface not being surrounded by said covering and therefore being in direct thermally conductive contact with the medium.

2. The sensor configuration according to claim 1 , wherein said electrically insulating covering is composed of a thermosetting plastic or thermoplastic material.

3. The sensor configuration according to claim 1 , wherein said connection contacts are constructed as stamped grids.

4. The sensor configuration according to claim 1 , which further comprises:

an apparatus establishing thermal contact of said at least one part of said at least one connection contact with the medium,

said at least one connection contact having a contact surface; and

said apparatus having a contact surface not surrounded by said covering, therefore being in direct thermally conductive contact with the medium and being larger than said contact surface of said at least one connection contact.

5. The sensor configuration according to claim 4 , wherein said apparatus is a part of each said at least one connection contact.

6. The sensor configuration according to claim 1 , wherein said covering is an encapsulation, a casting or a multipartite housing.

7. The sensor configuration according to claim 1 , wherein said sensor body is a resistor with a positive or negative temperature coefficient.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE SPELLING OF THE ASSIGNEE NAME FROM VITESCO TEHNOLOGIES GERMANY GMBH TO VITESCO TECHNOLOGIES GERMANY GMBH PREVIOUSLY RECORDED ON REEL 053100 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Recorded Sep 23, 2020
From: CONTI TEMIC MICROELECTRONIC GMBH
To: VITESCO TECHNOLOGIES GERMANY GMBH
Reel/Frame 053859/0329 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE SPELLING OF THE ASSIGNEE FROM VITESCO TEHNOLOGIES GERMANY GMBH TO VITESCO TECHNOLOGIES GERMANY GMBH PREVIOUSLY RECORDED ON REEL 053100 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. Recorded Aug 14, 2020
From: CONTI TEMIC MICROELECTRONIC GMBH
To: VITESCO TECHNOLOGIES GERMANY GMBH
Reel/Frame 054523/0456 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2020
From: CONTI TEMIC MICROELECTRONIC GMBH
To: VITESCO TEHNOLOGIES GERMANY GMBH
Reel/Frame 053100/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2016
From: KEUTEN, MATTHIAS; VÖGERL, ANDREAS; HENNIGER, JÜRGEN; WIECZOREK, MATTHIAS; WITTMANN, LISA-MARIA
To: CONTI TEMIC MICROELECTRONIC GMBH
Reel/Frame 038521/0187 →
Priority Claims (1)
DE 10 2013 219 094 · Sep 23, 2013 · national
Continuity (1)
Related Publication 20160231184A1 · Aug 11, 2016