IP Library › Granted Patent US 10,373,749
Granted Patent B2
US 10,373,749 · App. 15/025,473 · Granted Aug 6, 2019

Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device

Inventors: Shotaro Masuda (Osaka, JP); Hirofumi Ebe (Osaka, JP); Takashi Habu (Osaka, JP); Akihito Matsutomi (Osaka, JP)
Assignee: NITTO DENKO CORPORATION
H01F1/28B22F1/0011B22F1/0055H01F3/08H01F5/00H05K3/285B22F2007/042C22C33/0257C22C2202/02H05K1/0373H05K2201/0245H05K2201/086
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,373,749
App. No.
15/025,473
Granted
Aug 6, 2019
Kind
B2
Abstract

Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D 10 and a particle size D 50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D 10 /D 50 >0.30.

Claims (14)

1. Soft magnetic particle powder composed of flat soft magnetic particles,

wherein the soft magnetic particle powder has a particle size D 10 and a particle size D 50 measured with a laser diffraction particle size distribution analyzer satisfying formula below:

D 10 /D 50 >0.45,

wherein the particle size D 50 is 40 μm or more, and

wherein the soft magnetic particle powder has a particle size D 90 measured with the laser diffraction particle size distribution analyzer that is 100 μm or more and 150 μm or less.

2. A soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

3. The soft magnetic resin composition according to claim 2 , wherein

the resin component contains epoxy resin, phenol resin, and acrylic resin.

4. A soft magnetic film formed from a soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

5. A soft magnetic film laminated circuit board produced by laminating a soft magnetic film on a circuit board, wherein

the soft magnetic film is formed from a soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

6. A position detection device comprising:

a soft magnetic film laminated circuit board produced by laminating a soft magnetic film on a circuit board, wherein

the soft magnetic film is formed from a soft magnetic resin composition containing the soft magnetic particle powder according to claim 1 and a resin component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2016
From: MASUDA, SHOTARO; EBE, HIROFUMI; HABU, TAKASHI; MATSUTOMI, AKIHITO
To: NITTO DENKO CORPORATION
Reel/Frame 038757/0912 →
Priority Claims (2)
JP 2013-206710 · Oct 1, 2013 · national
JP 2014-175877 · Aug 29, 2014 · national
Continuity (1)
Related Publication 20160211061A1 · Jul 21, 2016