IP Library Granted Patent US 10,132,000
Granted Patent B2
US 10,132,000 · App. 15/026,063 · Granted Nov 20, 2018

Diamond substrate and diamond substrate manufacturing method

Inventors: Hideo Aida (Tokyo, JP); Koji Koyama (Tokyo, JP); Kenjiro Ikejiri (Tokyo, JP); Seongwoo Kim (Tokyo, JP)
Assignee: ADAMANT NAMIKI PRECISION JEWEL CO., LTD.
C30B25/18C23C16/01C23C16/274C30B25/105C30B29/04C30B33/02
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Quick Facts
Patent No.
US 10,132,000
App. No.
15/026,063
Granted
Nov 20, 2018
Kind
B2
Abstract

A diamond substrate is formed of diamond single crystals by preparing a base substrate; forming plural pillar-shaped diamonds formed of diamond single crystals on one side of the base substrate; causing a diamond single crystal to grow from a tip of each pillar-shaped diamond and coalescing the diamond single crystals growing from the tips of the pillar-shaped diamonds to form a diamond substrate layer; separating the diamond substrate layer from the base substrate; and manufacturing a diamond substrate from the diamond substrate layer, a shape in an in-plane direction of the diamond substrate is a circular shape or a circular shape having an orientation flat plane formed therein and has a diameter of two inches or more.

Claims (16)

1. A diamond substrate manufacturing method comprising:

preparing a base substrate;

forming a plurality of pillar-shaped diamonds formed of diamond single crystals on one side of the base substrate;

causing a diamond single crystal to grow from a tip of each pillar-shaped diamond and coalescing the diamond single crystals grown from the tips of the pillar-shaped diamonds to form a diamond substrate layer;

separating the diamond substrate layer from the base substrate; and

manufacturing a diamond substrate from the diamond substrate layer,

wherein a shape in an in-plane direction of the diamond substrate is a circular shape or a circular shape having an orientation flat plane formed therein and has a diameter of two inches or more.

2. The diamond substrate manufacturing method according to claim 1 , wherein the separating of the diamond substrate layer from the base substrate is performed by generating a stress in the pillar-shaped diamonds and destroying the pillar-shaped diamonds.

3. The diamond substrate manufacturing method according to claim 2 , wherein the stress is a stress generated due to a difference in lattice constant between the base substrate and the diamond substrate layer and/or a stress generated due to a difference in thermal expansion coefficient between the base substrate and the diamond substrate layer.

4. The diamond substrate manufacturing method according to claim 1 , wherein an aspect ratio of each pillar-shaped diamond is equal to or more than five.

5. The diamond substrate manufacturing method according to claim 1 , wherein a diameter and a pitch of the pillar-shaped diamonds are set to 10 p.m or less.

6. The diamond substrate manufacturing method according to claim 1 , wherein surface roughness Ra of the one side of the base substrate is equal to or less than 10 nm.

7. The diamond substrate manufacturing method according to claim 1 , wherein a height direction of the pillar-shaped diamonds is set to a direction perpendicular to (001) plane of diamond single crystals forming the pillar-shaped diamonds.

8. The diamond substrate manufacturing method according to claim 1 , wherein each pillar-shaped diamond has a cylindrical shape, and

a diameter of a central portion of each pillar-shaped diamond in the height direction is smaller than a diameter of a tip portion thereof.

9. The diamond substrate manufacturing method according to claim 1 , wherein the diameter ranges from two inches to eight inches.

Assignments (3)
CHANGE OF NAME Recorded Apr 16, 2024
From: ADAMANT NAMIKI PRECISION JEWEL CO., LTD.
To: ORBRAY CO., LTD.
Reel/Frame 067124/0717 →
CHANGE OF NAME Recorded Apr 20, 2018
From: NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
To: ADAMANT NAMIKI PRECISION JEWEL CO., LTD.
Reel/Frame 045600/0301 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2016
From: AIDA, HIDEO; KOYAMA, KOJI; IKEJIRI, KENJIRO; KIM, SEONGWOO
To: NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
Reel/Frame 038244/0368 →
Priority Claims (1)
JP 2013-203784 · Sep 30, 2013 · national
Continuity (1)
Related Publication 20160237592A1 · Aug 18, 2016