Curable composition, cured coating film using same, and printed wiring board
Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).
1. A curable composition, comprising:
a photobase generator;
an epoxy group-containing (meth)acrylate compound;
a photopolymerization initiator; and
a thermosetting component other than the epoxy group-containing (meth)acrylate compound,
wherein the epoxy group-containing (meth)acrylate compound is a low-molecular-weight material that is a monomer or an oligomer and having a molecular weight in a range of 100 to 1,000, the photobase generator is in an amount of from 0.1 to 40 parts by mass with respect to 100 parts by mass of the thermosetting component and generates a catalyst for addition reaction between the epoxy group-containing (meth)acrylate compound and the thermosetting component by photoirradiation, and the thermosetting component is in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the curable composition.
2. A curable composition, comprising:
a photobase generator having a function as a photopolymerization initiator;
an epoxy group-containing (meth)acrylate compound; and
a thermosetting component other than the epoxy group-containing (meth)acrylate compound,
wherein the epoxy group-containing (meth)acrylate compound is a low-molecular-weight material that is a monomer or an oligomer and having a molecular weight in a range of 100 to 1,000, the photobase generator is in an amount of from 0.1 to 40 parts by mass with respect to 100 parts by mass of the thermosetting component and generates a catalyst for addition reaction between the epoxy group-containing (meth)acrylate compound and the thermosetting component by photoirradiation, and the thermosetting component is in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the curable composition.
3. The curable composition according to claim 1 , wherein the thermosetting component is a compound comprising at least two functional groups that react with an epoxy group.
4. The curable composition according to claim 3 , wherein the compound comprising at least two functional groups is at least one of a carboxyl group-containing compound and an acid anhydride.
5. The curable composition according to claim 1 , further comprising:
a bifunctional (meth)acrylate compound having no epoxy group.
6. The curable composition according to claim 5 , wherein the bifunctional (meth)acrylate compound having no epoxy group has a viscosity of 5 to 50 mPa·s at 25° C.
7. A curable composition, comprising:
a photobase generator;
a carboxyl group-containing (meth)acrylate compound;
a photopolymerization initiator; and
a thermosetting component other than the carboxyl group-containing (meth)acrylate compound,
wherein the carboxyl group-containing (meth)acrylate compound is a low-molecular-weight material that is a monomer or an oligomer and having a molecular weight in a range of 100 to 1,000, the photobase generator is in an amount of from 0.1 to 40 parts by mass with respect to 100 parts by mass of the thermosetting component and generates a catalyst for addition reaction between the carboxyl group-containing (meth)acrylate compound and the thermosetting component by photoirradiation, and the thermosetting component is in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the curable composition.
8. A curable composition, comprising:
a photobase generator having a function as a photopolymerization initiator;
a carboxyl group-containing (meth)acrylate compound; and
a thermosetting component other than the carboxyl group-containing (meth)acrylate compound,
wherein the carboxyl group-containing (meth)acrylate compound is a low-molecular-weight material that is a monomer or an oligomer and having a molecular weight in a range of 100 to 1,000, the photobase generator is in an amount of from 0.1 to 40 parts by mass with respect to 100 parts by mass of the thermosetting component and generates a catalyst for addition reaction between the carboxyl group-containing (meth)acrylate compound and the thermosetting component by photoirradiation, and the thermosetting component is in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the curable composition.
9. The curable composition according to claim 7 , wherein the thermosetting component is a compound comprising at least two functional groups that react with a carboxyl group.
10. The curable composition according to claim 9 , wherein the compound comprising at least two functional groups that react with a carboxyl group is an epoxy compound.
11. The curable composition according to claim 10 , wherein the epoxy compound has crystallinity.
12. The curable composition according to claim 7 , further comprising:
a bifunctional (meth)acrylate compound having no carboxyl group.
13. The curable composition according to claim 12 , wherein the bifunctional (meth)acrylate compound having no carboxyl group has a viscosity of 5 to 50 mPa·s at 25° C.
14. The curable composition according to claim 1 , having a viscosity of 5 to 50 mPa·s at 50° C.
15. A cured coating film, obtained by photoirradiating the curable composition according to claim 1 .
16. A printed wiring board, comprising:
a pattern-cured coating film obtained by a process comprising printing the curable composition according to claim 1 on a substrate, and photoirradiating the curable composition printed on the substrate.
17. A printed wiring board, comprising:
a pattern-cured coating film obtained by a process comprising printing the curable composition according to claim 1 on a substrate by an ink-jet printing method, and photoirradiating the curable composition printed on the substrate.
18. The printed wiring board according to claim 16 , wherein the substrate is a plastic substrate.
19. The printed wiring board according to claim 17 , wherein the substrate is a plastic substrate.
20. The curable composition according to claim 1 , wherein the photobase generator is included in an amount of from 0.1 to 40 parts by mass with respect to 100 parts by mass of the thermosetting component other than the epoxy group-containing (meth)acrylate compound, the epoxy group-containing (meth)acrylate compound is included in an amount of from 5 to 50 parts by mass with respect to 100 parts by mass of the curable composition, and the photopolymerization initiator is included in an amount of from 0.5 to 10 parts by mass with respect to 100 parts by mass of the curable composition.