Semiconductor device and method for manufacturing same

1. A semiconductor device comprising:

a substrate;

a first thin film transistor on the substrate, the first thin film transistor including a first active region which includes a crystalline silicon; and

a second thin film transistor on the substrate, the second thin film transistor including a second active region which includes an oxide semiconductor including a crystalline portion, wherein

a first layer in which the first active region is defined and a second layer in which the second active region is defined are provided in separate layers, the semiconductor device further including an insulating layer between the first layer and the second layer,

when viewed from a normal direction to the substrate, the insulating layer overlaps both of the first active region and the second active region,

the insulating layer includes a multilayer structure including a hydrogen donor layer that supplies hydrogen and an oxygen donor layer that supplies oxygen, the oxygen donor layer being located closer to the second active region than the hydrogen donor layer,

the hydrogen donor layer is thicker than the oxygen donor layer, a thickness of the hydrogen donor layer being not less than 150 nm and not more than 450 nm and a thickness of the oxygen donor layer being not less than 30 nm and not more than 100 nm,

the semiconductor device further includes:

a display region including a plurality of pixels; and

a driving circuit defining region in a region other than the display region, the driving circuit defining region including a driver and a source shared driving circuit; and

the first thin film transistor is included in the source shared driving circuit and the second thin film transistor is provided for each of the plurality of pixels of the display region.

2. The semiconductor device of claim 1 , further comprising a first interlayer insulating film covering the first thin film transistor, wherein

the insulating layer defines the first interlayer insulating film and a gate insulating film of the second thin film transistor.

3. The semiconductor device of claim 1 , wherein, in the insulating layer, the hydrogen donor layer includes silicon nitride, and the oxygen donor layer includes silicon oxide.

4. The semiconductor device of claim 1 , wherein a gate electrode of the first thin film transistor and a gate electrode of the second thin film transistor are in a same layer.

5. The semiconductor device of claim 1 , wherein a source electrode and a drain electrode of the first thin film transistor and a source electrode and a drain electrode of the second thin film transistor are in a same layer.

6. The semiconductor device of claim 1 , wherein the oxide semiconductor comprises an In—Ga—Zn—O type semiconductor.

7. The semiconductor device of claim 1 , wherein the first thin film transistor has a top gate structure, and the second thin film transistor has a bottom gate structure.

8. The semiconductor device of claim 1 , wherein the crystalline silicon is a polycrystalline silicon.

9. The semiconductor device of claim 1 further comprising a passivation film covering the first thin film transistor and the second thin film transistor, wherein

a source electrode and a drain electrode of the second thin film transistor are on a layer in which the second active region is provided; and

the passivation film is in contact with the second active region, the source electrode, and the drain electrode of the second thin film transistor.

10. The semiconductor device of claim 9 , wherein the passivation film includes a lower layer of a silicon oxide film and an upper layer of a silicon nitride film.

11. The semiconductor device of claim 1 , wherein, in the insulating layer, the hydrogen donor layer includes silicon nitride oxide (SiNxOy, where x>y).

12. The semiconductor device of claim 1 , wherein, in the insulating layer, the oxygen donor layer includes silicon oxide nitride (SiOyNx, where y>x).

13. A semiconductor device comprising:

a substrate;

a first thin film transistor on the substrate, the first thin film transistor including a first active region which includes a crystalline silicon; and

a second thin film transistor on the substrate, the second thin film transistor including a second active region which includes an oxide semiconductor including a crystalline portion, wherein

a first layer in which the first active region is defined and a second layer in which the second active region is defined are provided in separate layers, the semiconductor device further including an insulating layer between the first layer and the second layer,

when viewed from a direction normal to the substrate, the insulating layer overlaps both of the first active region and the second active region,

the insulating layer includes a multilayer structure including a hydrogen donor layer that supplies hydrogen and an oxygen donor layer that supplies oxygen, the oxygen donor layer being located closer to the second active region than is the hydrogen donor layer, and

the hydrogen donor layer is thicker than the oxygen donor layer, a thickness of the hydrogen donor layer being not less than 150 nm and not more than 450 nm and a thickness of the oxygen donor layer being not less than 30 nm and not more than 100 nm.