IP Library › Granted Patent US 9,976,027
Granted Patent B2
US 9,976,027 · App. 15/033,248 · Granted May 22, 2018

Polymer fine particle-containing curable resin composition having improved storage stability

Inventor: Toshihiko Okamoto (Takasago, JP)
Assignee: KANEKA CORPORATION
C08L63/00C08G59/063C08G59/14C08G59/1477C09J11/04C09J11/08C09J163/00C08L51/04
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Quick Facts
Patent No.
US 9,976,027
App. No.
15/033,248
Granted
May 22, 2018
Kind
B2
Abstract

A curable resin composition of the present invention contains 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of an epoxy resin (A), wherein the polymer fine particle has a core-shell structure, the core layer of the polymer fine particle is diene rubber, the content of the epoxy group of the polymer fine particle (B) is 0.01 to 0.2 mmol/g. A curable resin composition (I) of the first embodiment contains 0.5 to 30 parts by mass of fumed silica as an inorganic filler (C). In addition, a curable resin composition (II) of the second embodiment contains bisphenol A epoxy resin and rubber-modified epoxy resin and/or urethane-modified epoxy resin as the epoxy resin (A).

Claims (37)

1. A curable resin composition (I) comprising:

an epoxy resin (A),

from 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of the epoxy resin (A),

from 0.5 to 300 parts by mass of an inorganic filler (C) relative to 100 parts by mass of the epoxy resin (A),

wherein

the polymer fine particle has a core-shell structure,

a core layer of the polymer fine particle is diene rubber,

a shell layer of the polymer fine particle is a polymer polymerized with one or more monomers having an epoxy group,

a content of the epoxy group of the polymer fine particle (B) is from 0.01 to 0.2 mmol/g, and

the inorganic filler is fumed silica.

2. A curable resin composition (II) comprising:

an epoxy resin (A) and

from 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of the epoxy resin (A),

wherein

the polymer fine particle has a core-shell structure,

a core layer of the polymer fine particle is diene rubber,

a shell layer of the polymer fine particle is a polymer polymerized with one or more monomers having an epoxy group,

a content of the epoxy group of the polymer fine particle (B) is from 0.01 to 0.2 mmol/g,

the epoxy resin (A) comprises at least one resin selected from the group consisting of a bisphenol A epoxy resin, rubber-modified epoxy resin, and urethane-modified epoxy resin.

3. The curable resin composition (II) according to claim 2 , further comprising from 0.5 to 30 parts by mass of fumed silica as an inorganic filler (C) relative to 100 parts by mass of the epoxy resin (A).

4. The curable resin composition according to claim 1 , wherein the curable resin composition (I) is an one-pack composition.

5. The curable resin composition according to claim 1 , further comprising from 1 to 80 parts by mass of an epoxy curing agent (D) relative to 100 parts by mass of the epoxy resin (A).

6. The curable resin composition according to claim 1 , further comprising from 0.1 to 10 parts by mass of a curing accelerator (E) relative to 100 parts by mass of the epoxy resin (A).

7. The curable resin composition according to claim 1 , further comprising from 0.1 to 10 parts by mass of calcium oxide (F) relative to 100 parts by mass of the epoxy resin (A).

8. The curable resin composition according to claim wherein the diene rubber is a butadiene rubber, butadiene-styrene rubber, or a combination thereof.

9. The curable resin composition according to claim 1 , wherein the shell layer is graft-polymerized on the core layer, and the shell layer is polymerized with one or more monomers selected from the group consisting of an aromatic vinyl monomer, a vinyl cyanide monomer, and a (meth) acrylate monomer.

10. The curable resin composition according to claim 1 , wherein the shell layer is graft-polymerized on the core layer.

11. The curable resin composition according to claim 10 , wherein the monomer having an epoxy group is glycidyl methacrylate.

12. The curable resin composition according to claim 1 , wherein the polymer fine particle is dispersed at the state of primary particle in the curable resin composition (I).

13. The curable resin composition according to claim 2 , wherein the epoxy resin (A) comprises the rubber-modified epoxy resin which is an acrylonitrile-butadiene modified epoxy resin.

14. A cured product of the curable resin composition (I) according to claim 1 .

15. A structural adhesive comprising the curable resin composition (I) according to claim 1 .

16. A structural adhesive for a vehicle, wherein the structural adhesive comprises the curable resin composition (I) according to claim 1 .

17. The curable resin composition according to claim 2 , wherein the shell layer is graft-polymerized on the core layer, and the shell layer is polymerized with one or more monomers selected from the group consisting of an aromatic vinyl monomer, a vinyl cyanide monomer, and a (meth) acrylate monomer.

18. The curable resin composition according to claim 2 , wherein the shell layer is graft-polymerized on the core layer.

19. The curable resin composition according to claim 18 , wherein the monomer having an epoxy group is glycidyl methacrylate.

20. The curable resin composition according to claim 2 , wherein the polymer fine particle is dispersed at the state of primary particle in the curable resin composition (II).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2016
From: OKAMOTO, TOSHIHIKO
To: KANEKA CORPORATION
Reel/Frame 038418/0447 →
Priority Claims (2)
JP 2013-223833 · Oct 29, 2013 · national
JP 2014-169859 · Aug 22, 2014 · national
Continuity (1)
Related Publication 20160244603A1 · Aug 25, 2016