IC module for different connection technologies

1. An integrated circuit (IC) module for installation in a portable data carrier having:

an upper side which, in the installed state, forms a part of the surface of the data carrier, and

contacting elements for establishing an electrical connection with mating contacting elements which are configured open in a recess in the data carrier,

wherein the contacting elements have at least a first set of contacting pads for a first connection technology and at least a second set of contacting pads for a second connection technology,

wherein a contacting pad of the first set of contacting pads in each case is electroconductively connected to a contacting pad of the second set of contacting pads, and

wherein the contacting pads of the second set of contacting pads are respectively configured in the form of a closed or open ring around the first set of contacting pads, which forms a unit with a conducting-track frame.

2. The module according to claim 1 , wherein the contacting pads of the first set of contacting pads are structured contacting pads and form a pattern with free areas which are framed by a frame consisting of conducting tracks to support electrical connections with mating contacting elements which are supplied in the form of conductive-material bumps.

3. The module according to claim 1 , wherein the contacting pads of the second set of contacting pads are solder areas to enable electrical connections using connection wires which are connected to the solder areas, on a first end of the connection wires, and to mating contacting elements, on a second end of the connection wires.

4. The module according to claim 1 , wherein the contacting pads of the second set of contacting pads are directly connected to the contacting pads of the first set of contacting pads.

5. The module according to claim 1 , wherein a free area of the first set of contacting pads is arranged at an intersection point of two strip-shaped axes, and all further free areas outside the axes.

6. The module according to claim 1 , wherein the mating contacting elements are configured as wire terminal areas.

7. The module according to claim 1 , wherein the IC module has at least one link system which is connected to the IC of the module, on a first end, and to at least one contacting pad, on a second end.

8. A method for manufacturing a portable data carrier having an integrated circuit (IC) and an electronic device having the steps of:

supplying an IC module according to claim 1 ,

supplying a portable data carrier having a recess prepared for receiving the IC module and having an electronic device formed in the data carrier and connected to mating contacting elements prepared in the recess,

inserting the IC module into the recess in the data carrier, wherein

upon insertion of the IC module one of the sets of contacting pads is connected to the prepared mating contacting elements by means of the appurtenant connection technology.

9. A system that is installable in a portable data carrier, comprising:

an upper side which, in the installed state, forms a part of the surface of the data carrier, and

contacting elements for establishing an electrical connection with mating contacting elements which are configured open in a recess in the data carrier,

wherein the contacting elements have at least a first set of contacting pads for a first connection technology and at least a second set of contacting pads for a second connection technology,

wherein a contacting pad of the first set of contacting pads in each case is electroconductively connected to a contacting pad of the second set of contacting pads, and

wherein the contacting pads of the second set of contacting pads are respectively configured in the form of a closed or open ring around the first set of contacting pads, which forms a unit with a conducting-track frame.

10. The system of claim 9 , wherein the mating contacting elements have the form of compressible conductive-material bumps.

11. The system of claim 10 , wherein the conductive-material bumps are at least partially elastic.

12. The system of claim 11 , wherein the at least partially elastic conductive-material bumps produce a continual counterpressure after a deformation.

13. The system of claim 10 , wherein the first set of contacting pads lies on the compressible conductive-material bumps.

14. The system of claim 10 , wherein the compressible conductive-material bumps form flat cakes that increase the connecting area available on the first set of contacting pads.

15. An integrated circuit (IC) module for installation in a portable data carrier having:

an upper side which, in the installed state, forms a part of the surface of the data carrier, and

contacting elements for establishing an electrical connection with mating contacting elements which are configured open in a recess in the data carrier,

wherein the contacting elements have at least a first set of contacting pads for a first connection technology and at least a second set of contacting pads for a second connection technology,

wherein a contacting pad of the first set of contacting pads in each case is electroconductively connected to a contacting pad of the second set of contacting pads,

wherein the contacting pads of the first set of contacting pads are structured contacting pads and form a pattern with free areas which are framed by a frame consisting of conducting tracks to support electrical connections with mating contacting elements which are supplied in the form of conductive-material bumps.