Thermally configured connector system
A connector system with improved thermal management is provided. A module includes a thermal dissipation system. A receptacle is provided that has a cage with thermal channels that allow air passing through the receptacle to directly remove thermal energy from the thermal dissipation system and carry the thermal energy out of the cage.
1. A module comprising:
a body with a first opening;
an active component positioned within the body;
a first thermal dissipation system extending through the opening, the thermal dissipation system having a thermal transfer area positioned outside a shell, the first thermal dissipation system thermally coupled to the active component and configured to provide a thermal resistance of less than 3 C/W between the active component and the thermal transfer area, wherein the shell has a first side and a second side opposing the first side, the first opening positioned on the first side, the shell further including a second opening on the second side, wherein a second thermal dissipation system is positioned in the second opening and the second thermal dissipation system is thermally coupled to an active component positioned within the body.
2. The module of claim 1 , wherein the thermal transfer area includes at least one fin.
3. The module of claim 1 , wherein the thermal dissipation system includes a rail.
4. The module of claim 1 , further including a sliding chassis and a pull tab mechanically coupled to the sliding chassis, the sliding chassis positioned inside the body, wherein translation of the pull tab causes the sliding chassis to translate.
5. The module of claim 4 , wherein sliding chassis has a first end and a second end, the first end being mechanically coupled to the pull tab and the second end including fingers.
6. A module, comprising:
a shell providing an enclosure, the shell having a top and bottom surface, an opening provided in one of the top and bottom surfaces;
a circuit card positioned in the shell;
an energy consumption device positioned in the shell and configured to provide electrical signals to the circuit card; and
a thermal dissipation system positioned along the opening, the thermal dissipation system extending into the opening and thermally coupled to the energy consumption device, the thermal dissipation system having a thermal dissipation area that is external the shell.
7. The module of claim 6 , wherein the thermal dissipation system includes a rail.
8. A module comprising:
a body having a first side and a second side opposing the first side, the body further including a first opening positioned on the first side and a second opening positioned on the second side;
at least one active component positioned within the body;
a first thermal dissipation system extending through the first opening, the first thermal dissipation system having a thermal transfer area positioned outside the body, the first thermal dissipation system thermally coupled to an active component of the at least one active component;
a second thermal dissipation system extending through the second opening, the second thermal dissipation system having a thermal transfer area positioned outside the body, the second thermal dissipation system thermally coupled to an active component of the at least one active component.
9. The module of claim 8 , wherein the thermal transfer area of the first thermal dissipation system includes at least one fin.
10. The module of claim 8 , wherein the first thermal dissipation system includes a rail.
11. The module of claim 8 , further including a sliding chassis and a pull tab mechanically coupled to the sliding chassis, the sliding chassis positioned inside the body, wherein translation of the pull tab causes the sliding chassis to translate.
12. The module of claim 11 , wherein sliding chassis has a first end and a second end, the first end being mechanically coupled to the pull tab and the second end including fingers.