IP Library › Granted Patent US 9,923,525
Granted Patent B2
US 9,923,525 · App. 15/043,593 · Granted Mar 20, 2018

Semiconductor integrated circuit, communication module, and smart meter

Inventor: Noriaki Matsuno (Tokyo, JP)
Assignee: Renesas Electronics Corporation
H03F1/52H01L27/0255H01L27/0296H03F1/565H03F3/195H03F3/245H03F2200/222H03F2200/294H03F2200/387H03F2200/444H03F2200/451H03F2200/534H03F2200/541
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Quick Facts
Patent No.
US 9,923,525
App. No.
15/043,593
Granted
Mar 20, 2018
Kind
B2
Abstract

A semiconductor integrated circuit includes a low-noise amplifier circuit, a transformer, and an ESD protection circuit. The low-noise amplifier circuit amplifies a radio signal that is supplied to an input terminal. The transformer includes a first winding and a second winding and functions as an input impedance matching circuit for the low-noise amplifier circuit, in which at least one end of the second winding is connected to the input terminal of the low-noise amplifier circuit. The ESD protection circuit is connected to a center tap of the first winding.

Claims (33)

1. A semiconductor integrated circuit comprising:

a low-noise amplifier circuit that amplifies a radio signal, the radio signal being supplied to an input terminal of the semiconductor integrated circuit;

a transformer that includes a first winding and a second winding and functions as an input impedance matching circuit for the low-noise amplifier circuit, at least one end of the first winding being connected to the input terminal of the semiconductor integrated circuit, and at least one end of the second winding being connected to an input terminal of the low-noise amplifier circuit; and

an ESD protection circuit that is connected to a center tap of the first winding.

2. The semiconductor integrated circuit according to claim 1 , wherein

when a position at which lengths from the one end and another end of the first winding are equal is P M , and a length from the one end to the other end of the first winding is L, the center tap is provided within a range of ±L×0.1 from the position P M .

3. The semiconductor integrated circuit according to claim 1 , wherein

the first winding and the second winding included in the transformer are first and second spiral inductors, respectively, formed on a semiconductor substrate.

4. The semiconductor integrated circuit according to claim 3 , wherein

the ESD protection circuit is comprised of a plurality of diodes connected in multiple stages formed on the semiconductor substrate.

5. The semiconductor integrated circuit according to claim 3 , wherein

the ESD protection circuit is disposed at a central part of the first spiral inductor.

6. The semiconductor integrated circuit according to claim 1 , wherein

at least the transformer, the low-noise amplifier circuit, and the ESD protection circuit are integrated into one semiconductor chip.

7. A semiconductor integrated circuit comprising:

a transmission amplifier circuit that amplifies a transmission signal;

a transformer that includes a first winding and a second winding and functions as an output impedance matching circuit for the transmission amplifier circuit, at least one end of the first winding being connected to an output terminal of the semiconductor integrated circuit, and at least one end of the second winding being connected to an output terminal of the transmission amplifier circuit; and

an ESD protection circuit that is connected to a center tap of the first winding,

wherein the first winding and the second winding included in the transformer are first and second spiral inductors, respectively, formed on a semiconductor substrate, and

wherein the ESD protection circuit is disposed at a central part of the first spiral inductor.

8. The semiconductor integrated circuit according to claim 7 , wherein

at least the transformer, the transmission amplifier circuit, and the ESD protection circuit are integrated into one semiconductor chip.

9. A communication module on which the semiconductor integrated circuit according to claim 1 is mounted.

10. A smart meter comprising the communication module according to claim 9 .

11. A semiconductor integrated circuit comprising:

a reception circuit comprising:

a low-noise amplifier circuit that amplifies a wireless signal, the wireless signal being supplied to an input terminal of the semiconductor integrated circuit;

a first transformer that includes a first winding and a second winding and functions as an input impedance matching circuit for the low-noise amplifier, at least one end of the second winding being connected to an input terminal of the low-noise amplifier circuit; and

a first ESD protection circuit, the first ESD protection circuit being connected to a center tap of the first winding; and

a transmission circuit comprising:

a transmission amplifier circuit that amplifies a transmission signal;

a second transformer that includes a third winding and a fourth winding and functions as an output impedance matching circuit for the transmission amplifier circuit, at least one end of the third winding being connected to an output terminal of the transmission amplifier circuit; and

a second ESD protection circuit that is connected to a center tap of the fourth winding.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: MATSUNO, NORIAKI
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 037741/0325 →
Priority Claims (1)
JP 2015-049068 · Mar 12, 2015 · national
Continuity (1)
Related Publication 20160268978A1 · Sep 15, 2016