Light-emitting device, light-emitting device package, and light unit
A light-emitting device, according to one embodiment, comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active layer which is underneath the first conductive semiconductor layer, and a second conductive semiconductor layer which is underneath the active layer; a reflective electrode, which is arranged under the light-emitting structure; and an electrode which is arranged inside the first conductive semiconductor layer and comprises a conductive ion injection layer.
1. A light emitting device comprising:
a substrate;
a bonding layer disposed on the substrate;
a metal layer disposed on the bonding layer;
a reflective electrode disposed on the metal layer;
an ohmic contact layer disposed on the reflective electrode layer;
a light emitting structure disposed on the ohmic contact layer and comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer;
an electrode disposed in the first conductive semiconductor layer; and
a pad disposed on the electrode,
wherein the ohmic contact layer is in contact with the second conductive semiconductor layer,
wherein the metal layer has a first region and a second region adjacent to the first region,
wherein the first region is disposed under the light emitting structure,
wherein the second portion is extended outwardly from the first region and is exposed to a lower outer peripheral portion of the light emitting structure, and
wherein a light extraction pattern is provided on a top surface of the light emitting structure and a top surface of the electrode.
2. The light emitting device of claim 1 , wherein the electrode is formed with a depth in a range of 50 nm to 3000 nm.
3. The light emitting device of claim 1 , wherein the electrode is spaced apart from the active layer by at least 100 nm.
4. The light emitting device of claim 1 , wherein the ohmic contact layer comprises at least one of Ti, Ag or Pt.
5. The light emitting device of claim 1 , wherein the reflective layer includes a metal, wherein the metal is at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au, or Hf.
6. The light emitting device of claim 1 , wherein the electrode is disposed at an outer portion of the first conductive semiconductor layer with a predetermined line width.
7. The light emitting device of claim 6 , wherein the electrode is disposed at a center of the first conductive semiconductor layer with a predetermined line width.
8. The light emitting device of claim 1 , wherein a width of the pad is narrower than a width of the electrode.
9. The light emitting device of claim 1 , wherein the pad has a multiple layer structure.
10. The light emitting device of claim 1 , wherein the pad includes at least one of Cr, V, W, Ti, Zn, Ni, Cu or Al.
11. The light emitting device of claim 1 , wherein the electrode vertically overlaps with the pad.
12. The light emitting device of claim 1 , wherein the electrode has a rectangular structure and a lower surface of the electrode is flat.
13. The light emitting device of claim 1 , wherein the pad is disposed at an edge portion of a top surface of the first conductive semiconductor layer and an upper surface of the pad is flat.
14. The light emitting device of claim 1 , wherein a lower surface of the pad has a concavo-convex pattern.
15. The light emitting device of claim 1 , wherein a thickness of the reflective electrode is greater than a thickness of the ohmic contact layer and a width of the reflective layer is narrower than a width of the ohmic contact layer.
16. The light emitting device of claim 1 , wherein a thickness of a portion of the metal layer is greater than a thickness of both of the ohmic contact layer and the reflective electrode.
17. A light emitting device comprising:
a substrate;
a bonding layer disposed on the substrate;
a metal layer disposed on the bonding layer;
a reflective electrode disposed on the metal layer;
an ohmic contact layer disposed on the reflective electrode layer;
a light emitting structure disposed on the ohmic contact layer and comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer;
an electrode disposed in the first conductive semiconductor layer; and
a pad disposed on the electrode,
wherein the ohmic contact layer is in contact with the first conductive semiconductor layer,
wherein the metal layer has a first region and a second region adjacent to the first region,
wherein the first region is disposed under the light emitting structure,
wherein the second portion is extended outwardly from the first region and is exposed to a lower outer peripheral portion of the light emitting structure,
wherein a light extraction pattern is provided on a top surface of the light emitting structure and a top surface of the electrode, and
wherein the electrode vertically overlaps with the pad and a width of the pad is narrower than a width of the electrode.
18. The light emitting device of claim 17 , wherein the electrode is formed with a depth in a range of 50 nm to 3000 nm.
19. The light emitting device of claim 17 , wherein a lower surface of the pad has a concavo-convex pattern.
20. A light emitting device comprising:
a substrate;
a bonding layer disposed on the substrate;
a metal layer disposed on the bonding layer;
a reflective electrode disposed on the metal layer;
an ohmic contact layer disposed on the reflective electrode layer;
a light emitting structure disposed on the ohmic contact layer and comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer;
an electrode disposed in the first conductive semiconductor layer; and
a pad disposed on the electrode,
wherein the ohmic contact layer is in contact with the first conductive semiconductor layer,
wherein the metal layer has a first region and a second region adjacent to the first region,
wherein the first region is disposed under the light emitting structure,
wherein the second portion is extended outwardly from the first region and is exposed to a lower outer peripheral portion of the light emitting structure,
wherein a light extraction pattern is provided on a top surface of the light emitting structure and a top surface of the electrode,
wherein the electrode vertically overlaps with the pad and a width of the pad is narrower than a width of the electrode, and
wherein a lower surface of the pad has a concavo-convex pattern.