Apparatuses and methods for internal heat spreading for packaged semiconductor die
Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plurality of die and a top surface of the bottom die extending beyond the plurality of die may be exposed. The barrier may be disposed alongside the plurality of die and the bottom die, and the heat spreader may be disposed over the exposed top surface of the bottom die and alongside the plurality of die.
1. An apparatus, comprising:
a plurality of die stacked in a first direction and having sides extending in the first direction;
a bottom die bonded with a bottom of the plurality of die, the bottom die including sides extending in the first direction, wherein at least a first side of the sides of the bottom die aligns with a first side of the sides of the plurality of die;
a substrate having bonded with a bottom side of the bottom die; and
a barrier comprising a plurality of layers of wire arranged in a stack and disposed along the first side of the sides of the plurality of die and along the first side of the sides of the bottom die, wherein the barrier comprises at least:
a first layer of wire formed on a top side of the substrate, wherein a length of the first layer of wire extends along the first side of the sides of the bottom die and the first side of the sides of the plurality of die, the first layer of wire comprising one or more wires each of the one or more wires having a first end and a second end each of the first end and the second end bonded to the top side of the substrate; and
a second layer of wire stacked over the first layer of wire in the first direction, wherein a length of the second layer of wire extends along the first side of the sides of the bottom die and the first side of the sides of the plurality of die, the second layer of wire comprising one or more wires each of the one or more wires having a first end and a second end each of the first end and the second end bonded to the top side of the substrate.
2. The apparatus of claim 1 further comprising a heat spreader, wherein a portion of the bottom die extends beyond the plurality of die in a second direction perpendicular to the first direction from a second side of the sides of the plurality of die, wherein the portion comprises a top surface not overlapped with the plurality of die in the first direction, and wherein the heat spreader is disposed on the top surface of the bottom die along with the second side of the sides of the plurality of die, wherein the head spreader comprises a plurality of wires arranged in a stack, each of the plurality of wires having a first end and a second end each of the first end and the second end extending beyond the top surface of the bottom die to be in direct contact with the substrate.
3. The apparatus of claim 1 , wherein the barrier is supported by the substrate.
4. The apparatus of claim 1 , wherein the wire is round wire.
5. The apparatus of claim 2 wherein the heat spread and the barrier are configured to limit an amount of under fill material wicking from spaces between the plurality of die.
6. The apparatus of claim 1 , wherein the bottom die comprises a logic die and the plurality of die comprises a plurality of memory die.
7. The apparatus of claim 2 , a lid coupled to the substrate and configured to enclose the bottom die, the plurality of die, the heat spreader, and the barrier.
8. The apparatus of claim 2 , wherein the heat spreader and the barrier are commensurate in height with a top of the plurality of die.