Contact area structure and method for manufacturing the same
A method for manufacturing a semiconductor device includes forming a contact area opening in a dielectric structure, depositing a contact area metal in the contact area opening, forming a metal cap layer on the contact area metal, forming one or more dielectric layers on the metal cap layer, forming one or more hard mask layers on the one or more dielectric layers, forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer, removing the one or more hard mask layers, and forming a metallization layer in the metallization opening on the metal cap layer.
1. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers; and
forming a metallization layer in the metallization opening on the metal cap layer;
wherein the contact area metal comprises cobalt and the metal cap layer comprises ruthenium.
2. The method according to claim 1 , wherein the dielectric structure comprises a plurality of dielectric layers in a stacked configuration.
3. The method according to claim 1 , wherein the ruthenium is deposited using chemical vapor deposition.
4. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers; and
forming a metallization layer in the metallization opening on the metal cap layer;
wherein the contact area metal comprises tungsten and the metal cap layer comprises cobalt.
5. The method according to claim 4 , wherein the cobalt is deposited using chemical vapor deposition.
6. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers;
forming a metallization layer in the metallization opening on the metal cap layer;
planarizing the contact area metal on the dielectric structure after depositing the contact area metal in the contact area opening; and
removing an upper portion of the contact area metal from the contact area opening to form a recessed area in the contact area opening.
7. The method according to claim 6 , wherein a depth of the recessed area from a top surface of the dielectric structure is in a range of about 3 nm to about 10 nm.
8. The method according to claim 6 , wherein the metal cap layer is formed in the recessed area.
9. The method according to claim 8 , wherein the metallization opening extends into the dielectric structure along a side of the metal cap layer.
10. The method according to claim 1 , further comprising depositing a flash film in the contact area opening prior to depositing the contact area metal in the contact area opening, wherein the flash film is deposited on sides and a bottom of the contact area opening.
11. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers;
forming a metallization layer in the metallization opening on the metal cap layer; and
depositing a flash film in the contact area opening prior to depositing the contact area metal in the contact area opening, wherein the flash film is deposited on sides and a bottom of the contact area opening;
wherein the contact area metal comprises cobalt and the flash film comprises ruthenium.
12. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers;
forming a metallization layer in the metallization opening on the metal cap layer; and
depositing a flash film in the contact area opening prior to depositing the contact area metal in the contact area opening, wherein the flash film is deposited on sides and a bottom of the contact area opening;
wherein the contact area metal comprises tungsten and the flash film comprises cobalt.
13. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers;
forming a metallization layer in the metallization opening on the metal cap layer; and
depositing a flash film in the contact area opening prior to depositing the contact area metal in the contact area opening, wherein the flash film is deposited on sides and a bottom of the contact area opening;
wherein a thickness of the flash film is in a range of about 2 nm to about 5 nm.
14. A method for manufacturing a semiconductor device, comprising:
forming a contact area opening in a dielectric structure;
depositing a contact area metal in the contact area opening;
forming a metal cap layer on the contact area metal;
forming one or more dielectric layers on the metal cap layer;
forming one or more hard mask layers on the one or more dielectric layers;
forming a metallization opening through the one or more dielectric and hard mask layers, wherein the metallization opening exposes the metal cap layer;
removing the one or more hard mask layers;
forming a metallization layer in the metallization opening on the metal cap layer; and
depositing a flash film in the contact area opening prior to depositing the contact area metal in the contact area opening, wherein the flash film is deposited on sides and a bottom of the contact area opening;
wherein the metallization opening extends into the dielectric structure along a side of the contact area opening comprising the flash film.
15. A semiconductor device, comprising:
a contact area opening in a dielectric structure;
a contact area metal formed in the contact area opening;
a metal cap layer on the contact area metal;
one or more dielectric layers on the dielectric structure;
a metallization opening formed through the one or more dielectric layers, wherein the metallization opening extends to the metal cap layer;
a metallization layer in the metallization opening contacting the metal cap layer; and
a recessed area in the contact area opening, wherein the metal cap layer is formed in the recessed area.
16. The semiconductor device according to claim 15 , wherein the metallization opening extends into the dielectric structure along a side of the metal cap layer.
17. The semiconductor device according to claim 15 , further comprising a flash film on sides and a bottom of the contact area opening around the contact area metal, wherein the metallization opening extends into the dielectric structure along a side of the contact area opening comprising the flash film.
18. A method for manufacturing a semiconductor device, comprising:
forming a plurality of contact area openings in a dielectric structure;
depositing a contact area metal in each of the contact area openings;
forming a metal cap layer on each of the contact area metals;
forming one or more dielectric layers on the metal cap layers;
forming one or more hard mask layers on the one or more dielectric layers;
forming a plurality of metallization openings through the one or more dielectric and hard mask layers, wherein the metallization openings expose each of the metal cap layers;
removing the one or more hard mask layers; and
forming a metallization layer in each of the metallization openings on the metal cap layers.