IP Library › Granted Patent US 10,260,965
Granted Patent B2
US 10,260,965 · App. 15/053,531 · Granted Apr 16, 2019

Heat flow meter and electronic device

Inventors: Akira Ikeda (Chino, JP); Sakiko Shimizu (Matsumoto, JP)
Assignee: SEIKO EPSON CORPORATION
G01K13/002A61B5/01A61B5/681G01K17/00A61B2562/0271A61B2562/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,260,965
App. No.
15/053,531
Granted
Apr 16, 2019
Kind
B2
Abstract

A heat flow sensor includes a heat transfer layer that has first and second surfaces confronting each other and has flexibility and a temperature difference measurement unit that measures a temperature difference between the first and second surfaces of the heat transfer layer. The heat transfer layer includes a first member having flexibility and a second member with higher thermal conductivity than the first member. The thickness of the heat transfer layer is equal to or greater than 0.5 mm, thermal conductivity of the heat transfer layer is equal to or greater than 10 W/(m×K), and Shore hardness of the heat transfer layer is equal to or less than A50.

Claims (25)

1. A heat flow meter comprising:

a heat transfer unit that has first and second surfaces confronting each other and has flexibility; and

a temperature difference measurement unit that is embedded in the heat transfer unit and that measures a temperature difference between the first and second surfaces of the heat transfer unit,

wherein the heat transfer unit further includes a first member having flexibility and a second member dispersed in the first member, the second member having higher thermal conductivity than the first member.

2. The heat flow meter according to claim 1 ,

wherein a thickness of the heat transfer unit is equal to or greater than 0.5 mm, thermal conductivity of the heat transfer unit is equal to or greater than 10 W/(mxK), and Shore hardness of the heat transfer unit is equal to or less than A50.

3. The heat flow meter according to claim 2 ,

wherein a heat diffusion layer with thermal conductivity greater than 100 W/(mxK) is disposed on the first surface.

4. The heat flow meter according to claim 3 ,

wherein a protective layer formed of an organic substance is disposed on a surface of the heat diffusion layer.

5. The heat flow meter according to claim 4 ,

wherein the Shore hardness of the protective layer is equal to or less than A50.

6. The heat flow meter according to claim 4 ,

wherein the heat transfer unit, the heat diffusion layer, and the protective layer are joined to each other by sewing.

7. The electronic device according to claim 3 ,

wherein the heat diffusion layer causes a temperature distribution to be uniform in the plane of the first surface.

8. The heat flow meter according to claim 1 ,

wherein the temperature difference measurement unit measures a temperature difference based on temperature information at a plurality of points of the first surface and temperature information at a plurality of points of the second surface.

9. An electronic device comprising:

a belt on which a heat flow meter including a heat transfer unit that has first and second surfaces confronting each other and has flexibility and a temperature difference measurement unit that measures a temperature difference between the first and second surfaces of the heat transfer unit is mounted;

a casing that is connected to the belt; and

a control unit that is provided inside the casing and that controls the heat flow meter,

wherein the heat transfer unit further includes a first member having flexibility and a second member dispersed in the first member, the second member having higher thermal conductivity than the first member.

10. The electronic device according to claim 9 ,

wherein thermal conductivity of the belt is less than thermal conductivity of the heat transfer unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2016
From: IKEDA, AKIRA; SHIMIZU, SAKIKO
To: SEIKO EPSON CORPORATION
Reel/Frame 037830/0526 →
Priority Claims (1)
JP 2015-037885 · Feb 27, 2015 · national
Continuity (1)
Related Publication 20160252407A1 · Sep 1, 2016
Cited By (1)
US 12,196,624