Solution for reducing poor contact in info packages
A package includes a first package including a device die, a molding compound molding the device die therein, a through-via penetrating through the molding compound, and a first plurality of Redistribution Lines (RDLs) and a second plurality of RDLs on opposite sides of the molding compound. The through-via electrically couples one of the first plurality of RDLs to one of the second plurality of RDLs. The package further includes a second package bonded to the first package, a spacer disposed in a gap between the first package and the second package, and a first electrical connector and a second electrical connector on opposite sides of the spacer. The first electrical connector and the second electrically couple the first package to the second package. The spacer is spaced apart from the first electrical connector and the second electrical connector.
1. A package comprising:
a first package comprising:
a device die;
an encapsulating material encapsulating the device die therein; and
a through-via penetrating through the encapsulating material;
a second package over and bonded to the first package;
a spacer disposed in a gap between the first package and the second package, wherein the spacer comprises a first portion contacting the first package, and a second portion over the first portion, with an interface located between the first portion and the second portion; and
a first electrical connector and a second electrical connector on opposite sides of the spacer, with the first electrical connector and the second electrical connector electrically coupling the first package to the second package, wherein the spacer is spaced apart from the first electrical connector and the second electrical connector.
2. The package of claim 1 , wherein the first portion and the second portion of the spacer comprise different materials.
3. The package of claim 1 , wherein the spacer is in contact with the second package.
4. The package of claim 1 further comprising a plurality of electrical connectors electrically coupling the first package to the second package, wherein the plurality of electrical connectors is aligned to a ring encircling the spacer.
5. The package of claim 1 , wherein the first package comprises a passivation layer, with the first electrical connector and the second electrical connector comprising solder regions penetrating through the passivation layer, and wherein the spacer is in contact with the passivation layer.
6. The package of claim 1 , wherein the spacer comprises a semiconductor material, a metal, or a glass.
7. The package of claim 1 , wherein the spacer comprises an organic material.
8. A package comprising:
a first package comprising:
a device die;
an encapsulating material encapsulating the device die therein;
a plurality of through-vias penetrating through the encapsulating material;
a first plurality of Redistribution Lines (RDLs) underlying, and overlapped by, the device die and the encapsulating material; and
a first plurality of solder region underlying, and electrically coupled to, the first plurality of RDLs;
a second package over the first package;
a first spacer disposed in a gap between the first package and the second package, wherein the first spacer is in contact with a top surface of the first package;
a second spacer overlapping the first spacer, wherein the second spacer is in contact with a bottom surface of the second package; and
a second plurality of solder regions bonding the first package to the second package, wherein the first spacer is encircled by the second plurality of solder regions.
9. The package of claim 8 further comprising:
a second plurality of RDLs over the encapsulating material, wherein the first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias; and
a passivation layer overlapping the second plurality of RDLs, wherein the second plurality of solder regions penetrate through the passivation layer to connect to the second plurality of RDLs.
10. The package of claim 8 , wherein the first spacer comprises a semiconductor material, a metal, or a glass.
11. The package of claim 8 , wherein the first spacer comprises an organic material.
12. The package of claim 8 , wherein the first spacer is in contact with the second spacer.
13. The package of claim 8 , wherein the first spacer is spaced apart from the second spacer.
14. The package of claim 8 , wherein the first spacer and the second spacer have different top view areas.
15. A package comprising:
a first package comprising:
a device die;
a first encapsulating material encapsulating the device die therein; and
a through-via penetrating through the first encapsulating material;
a second package over and bonded to the first package;
a second encapsulating material between the first package and the second package;
a first spacer disposed in a gap between the first package and the second package, wherein the first spacer has a top surface in contact with a bottom surface of the second encapsulating material; and
solder regions bonding the first package to the second package.
16. The package of claim 15 , wherein the first spacer is spaced apart from the second package by the second encapsulating material, with all top surfaces of the first spacer in contact with the second encapsulating material.
17. The package of claim 15 further comprising a second spacer having a top surface in contact with a bottom surface of the second package, wherein the second spacer overlaps the first spacer.
18. The package of claim 17 , wherein the first spacer and the second spacer are spaced apart from each other by the second encapsulating material.
19. The package of claim 17 , wherein the first spacer and the second spacer are in contact with each other.
20. The package of claim 17 , wherein the first spacer and the second spacer have different top-view areas.