Pressurized payload compartment and mission agnostic space vehicle including the same
A compartment for a space vehicle includes a pressurized structure having a structural wall, the structural wall having interior surfaces facing an interior of the compartment and exterior surfaces exposed to an external environment. An internal mounting structure for mounting a component is provided within the compartment, and mounting features support the internal mounting structure from the pressurized structure. The internal mounting structure is spaced away from the interior surfaces of the pressurized structure, and a thermal fluid is provided in the pressurized structure. The thermal fluid enables convective heat transfer between the component mounted on the internal mounting structure and the interior surfaces of the pressurized structure.
1. A payload compartment for a space vehicle, comprising:
a pressurized structure having a structural wall, the structural wall having interior surfaces facing an interior of the payload compartment and exterior surfaces exposed to an external environment of space;
a payload electronic component provided within the payload compartment; and
mounting features supporting the payload electronic component from the pressurized structure,
wherein the payload electronic component is spaced away from the interior surfaces of the pressurized structure,
wherein the pressurized structure is filled with a thermal fluid, the thermal fluid enabling convective heat transfer between the payload electronic component and the interior surfaces of the pressurized structure, and
wherein the exterior surfaces of the structural wall are configured to exchange heat with the vacuum of space via radiation heat transfer.
2. The payload compartment of claim 1 , further comprising:
a payload hardware provided outside the pressurized structure, the payload hardware communicatively coupled to the payload electronic component.
3. The payload compartment of claim 1 , further comprising:
a payload hardware provided within the pressurized structure, the payload hardware communicatively coupled to the payload electronic component.
4. The payload compartment of claim 1 , further comprising:
a circulation device adapted to circulate the thermal fluid within the pressurized structure.
5. The payload compartment of claim 1 , further comprising:
a supply container containing pressurized thermal fluid, wherein the supply container is adapted to supplement the thermal fluid in the pressurized structure to maintain a predetermined internal pressure of the pressurized structure.
6. The payload compartment of claim 1 , further comprising:
an internal mounting structure for mounting the payload electronic component within the payload compartment,
wherein the mounting features are adapted to thermally isolate the internal mounting structure from the interior surfaces of the pressurized structure and isolate the internal mounting structure from loads associated with launch.
7. The payload compartment of claim 6 , wherein the internal mounting structure comprises:
a first mounting panel on which the payload electronic component is mounted.
8. The payload compartment of claim 6 , wherein the internal mounting structure comprises:
a base panel connected to the structural wall of the pressurized structure, and
a plurality of mounting panels for mounting the payload electronic component, the plurality of mounting panels removably coupled to the base panel.
9. The payload compartment of claim 8 , wherein the internal mounting structure further comprises:
a lower base panel for mounting a second payload electronic component, the lower base panel is being mounted between the base panel and the pressurized structure.
10. The payload compartment of claim 9 , wherein the base panel is mounted to the pressurized structure independently from how the lower base panel is mounted to the pressurized structure.
11. The payload compartment of claim 9 , wherein the base panel is coupled to the lower base panel.
12. The payload compartment of claim 1 , further comprising:
a surface coating provided on the exterior surfaces of the pressurized structure, the surface coating being adapted to vary emissivity and absorptivity of the exterior surfaces.
13. The payload compartment of claim 12 , further comprising:
radiator surfaces mounted to the exterior surfaces of the pressurized structure to expand a radiator surface area and/or vary emissivity and absorptivity area ratio properties to achieve desired internal operating temperatures in the pressurized structure.
14. The payload compartment of claim 1 , wherein the pressurized structure comprises:
a first structural body; and
a second structural body coupled to the first structural body.
15. The payload compartment of claim 14 , wherein the first structural body and the second structural body have a cylindrical shape.
16. The payload compartment of claim 14 , wherein
the first structural body comprises a first flange on an open end of the first structural body, and
the second structural body comprises a second flange on an open end of the second structural body, the second flange adapted to be coupled to the first flange to form a seal between the first structural body and the second structural body.
17. A pressurized space vehicle, comprising:
a pressurized spacecraft bus for enclosing bus components required for a mission; and
a pressurized payload compartment connected to the spacecraft bus,
wherein the pressurized spacecraft bus comprises:
a first pressurized structure having a first structural wall;
a first internal mounting structure for mounting the bus components within the first pressurized structure; and
first mounting features supporting the first internal mounting structure from the first pressurized structure,
wherein the pressurized payload compartment comprises:
a second pressurized structure having a second structural wall;
a payload electronic component provided within the second pressurized structure, the payload electronic component spaced away from the second pressurized structure; and
second mounting features supporting the payload electronic component from the second pressurized structure,
wherein the first pressurized structure is filled with a first thermal fluid and the second pressurized structure is filled with a second thermal fluid, the first thermal fluid enabling convective heat transfer between the bus components and the first pressurized structure, the second thermal fluid enabling convective heat transfer between the payload electronic component and the second pressurized structure, and
wherein exterior surfaces of the first pressurized structure and exterior surfaces of the second pressurized structure are configured to exchange heat through radiation heat transfer with an external environment of space.