IP Library Granted Patent US 9,929,135
Granted Patent B2
US 9,929,135 · App. 15/063,117 · Granted Mar 27, 2018

Apparatuses and methods for semiconductor circuit layout

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Quick Facts
Patent No.
US 9,929,135
App. No.
15/063,117
Granted
Mar 27, 2018
Kind
B2
Abstract

Apparatuses including circuit layout regions of a semiconductor device and methods of designing the circuit layout regions of a semiconductor device are described. An example apparatus includes a first layout region including a first transistor area including at least one first transistor, at least one contact in proximity to the first transistor area, and a first resistor area comprising at least one first resistor coupled to the at least one first transistor. The first transistor area and the at least one contact are aligned in a first direction, and the first transistor area and the first resistor area are aligned in a second direction. The second direction may be substantially perpendicular to the first direction. The at least one contact may be one of a substrate contact and a well contact.

Claims (40)

1. A device comprising:

first and second CMOS areas arranged in a first direction, each of the first and second CMOS areas including n-channel and p-channel transistors; and

a resistor area including first and second portions, the first and second portions disposed relative to the first and the second CMOS areas in a second direction, the second direction being substantially perpendicular to the first direction, and the resistor area including a resistor that extends continuously from the first portion to the second portion in the first direction.

2. The device of claim 1 , further comprising:

a first layout region extending in the second direction and including the first CMOS area and the first portion of the resistor area;

a second layout region adjacent to the first layout region in the first direction, extending in the second direction, the second layout region including the second CMOS area and the second portion of the resistor area; and

a second resistor area adjacent to the resistor area in the second direction, the second resistor area including a second resistor that extends continuously from the first layout region to the second layout region in the first direction.

3. The device of claim 1 , further comprising a second resistor area adjacent to the first and the second CMOS areas in a third direction opposite to the second direction.

4. The device of claim 2 , further comprising:

a third CMOS area; and

a third layout region adjacent to the second layout region in the first direction, extending in the second direction and including the third CMOS area and a third portion of the resistor area,

wherein the resistor area extends continuously across the first layout region, the second layout region, and the third layout region.

5. The device of claim 1 , further comprising a third CMOS area adjacent to the resistor area in the second direction.

6. The device of claim 1 , further comprising a third CMOS area adjacent to the first CMOS area in a third direction opposite to the second direction.

7. An apparatus comprising:

a first layout region comprising a first transistor area comprising at least one first transistor;

at least one contact area adjacent to the first transistor area; and

a first resistor area comprising at least one first resistor coupled to the at least one first transistor.

8. The apparatus of claim 7 , wherein the at least one contact area includes one of:

a substrate contact configured to couple the at least one first transistor to a substrate region when the at least one first transistor is an n-channel transistor; and

a well contact configured to couple the at least one first transistor to a well region when the at least one first transistor is a p-channel transistor.

9. The apparatus of claim 7 , wherein the first resistor area is outside of an area defined by the at least one contact area and the first transistor area.

10. The apparatus of claim 7 , wherein the first transistor area and the at least one contact area are aligned to each other along a first direction, and

wherein the first transistor area and the first resistor area are adjacent to each other along a second direction.

11. The apparatus of claim 10 , he second direction is substantially perpendicular to the first direction.

12. The apparatus of claim 11 , further comprising:

a second layout region adjacent to the first layout region in the first direction, the second layout region comprising:

a second transistor area comprising at least one second transistor,

wherein the first transistor area, the second transistor area, and the at least one contact are area aligned along the first direction, and

wherein the first resistor area is adjacent to the first transistor area and the second transistor area along the second direction.

13. The apparatus of claim 12 , wherein the first resistor area extends across the first layout region to the second layout region in the first direction.

14. The apparatus of claim 12 , further comprising:

a second resistor area comprising at least one second resistor coupled to the at least one second transistor,

wherein the second resistor area is adjacent to the first transistor area and the second transistor area along the second direction.

15. The apparatus of claim 12 , further comprising:

a second resistor area comprising at least one second resistor coupled to the at least one second transistor,

wherein the second resistor area is adjacent to the first transistor area and the second transistor area along a third direction substantially opposite to the second direction.

16. The apparatus of claim 12 , further comprising:

a second resistor area comprising at least one second resistor coupled to the at least one second transistor,

wherein the first resistor area is in the first layout region and the second resistor area is in the second layout region.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2016
From: TANUMA, YASUHIKO; ISHIHARA, TAKASHI
To: MICRON TECHNOLOGY, INC.
Reel/Frame 037913/0309 →