Package for ultraviolet emitting devices
Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.
1. A device comprising:
a light emitting diode (LED) comprising a semiconductor structure comprising an active layer disposed between an n-type region and a p-type region, wherein the active layer emits ultraviolet radiation;
a mount, wherein the LED is disposed on the mount;
a support surrounding a conductive slug, the support comprising electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED;
wherein the mount is disposed on the conductive slug;
a circuit board, wherein the support is disposed on the circuit board; and
a heat pipe disposed entirely within the support, the heat pipe comprising a sealed chamber filled with a fluid, wherein the fluid is not in direct contact with the LED.
2. The device of claim 1 further comprising an optic disposed over the LED.
3. The device of claim 2 wherein the optic is a parabolic lens.
4. The device of claim 2 further comprising an encapsulant material disposed between the optic and the LED.
5. The device of claim 4 wherein an empty cavity surrounds the encapsulant material.
6. The device of claim 4 wherein the encapsulant material is a first encapsulant material, the device further comprising a second encapsulant material surrounding the first encapsulant material, wherein the second encapsulant material is less UV-transparent than the first encapsulant material.
7. The device of claim 1 wherein the heat pipe comprises a sealed tube filled with a fluid under vacuum.
8. The device of claim 7 wherein the tube is conductive.
9. The device of claim 7 wherein the tube is copper.
10. The device of claim 1 wherein the heat pipe is a first heat pipe, the device further comprising a second heat pipe disposed within the support and not in direct contact the LED.
11. The device of claim 1 wherein the support is shaped into a reflector cup.
12. The device of claim 1 wherein the mount comprises a material selected from the group consisting of ceramic, diamond, AlN, and beryllium oxide.
13. The device of claim 1 wherein the mount comprises an electrically conductive material selected from the group consisting of silicon, metal, alloy, Al, and Cu, wherein the electrically conductive material is coated with an insulating layer selected from the group consisting of silicon oxide, silicon nitride, and aluminum oxide.
14. The device of claim 1 wherein the support is material selected from the group consisting of ceramic, aluminum oxide, aluminum nitride, silicone molding compound (SMC), and epoxy molding compound (EMC).
15. The device of claim 1 wherein the circuit board comprises a thermal pad and first and second electrical pads isolated from the thermal pad by an insulating structure, wherein the conductive slug is disposed over and directly connected to the thermal pad and the electrically conductive contact pads are connected to the first and second electrical pads.
16. The device of claim 15 wherein the thermal pad comprises one of a Cu slug and an AlN slug.
17. The device of claim 15 wherein circuit board comprises a metal core circuit board, and the thermal pad comprises the metal core.