Packaged semiconductor device having bent leads and method for forming

1. A package device, comprising:

a first lead frame having a first flag;

a first integrated circuit on the first flag;

a first encapsulant over the first integrated circuit;

a first plurality of leads, electrically bonded to the first integrated circuit, wherein a first lead of the first plurality of leads has an inner portion covered by the first encapsulant and an outer portion extending outside the encapsulant, wherein:

the outer portion has a hole extending completely through the first lead;

the outer portion has a bend at the hole; and

the outer portion extends above the first encapsulant.

2. The package device of claim 1 , further comprising:

a second lead frame having a second flag;

a second integrated circuit on the second flag;

a second encapsulant over the second integrated circuit and the first encapsulant;

a second plurality of leads, electrically bonded to the second integrated circuit, wherein a second lead of the second plurality of leads has an inner portion covered by the second encapsulant and an outer portion extending outside the second encapsulant, wherein:

the outer portion of the first lead electrically contacts the second lead.

3. The package device of claim 2 , wherein the second lead has a hole and the first lead enters the hole in the second lead.

4. The package device of claim 3 , wherein the second lead has a bend at the hole in the second lead and the second lead extends above the second encapsulant.

5. The package device of claim 4 , wherein the outer portion of the first lead has a first portion between the first encapsulant and the hole in the first lead that extends laterally from the first encapsulant and a second portion that extends above the first encapsulant.

6. The package device of claim 5 , wherein the second portion of the outer portion of the first lead has a tapered tip where it extends above the first encapsulant.

7. The package device of claim 1 , wherein the first plurality of leads has a first portion extending from a first side of the encapsulant, a second portion extending from a second side of the encapsulant, a third portion extending from a third side of the encapsulant, and a fourth portion extending from a fourth side of the encapsulant.

8. The package device of claim 1 , further comprising a wire bond coupled between the first integrated circuit and the first lead.

9. The package device of claim 1 , wherein the first lead has an exposed portion coplanar with a bottom surface of the package device.

10. A package device, comprising:

a first lead frame having a first flag and a first plurality of leads;

a first integrated circuit on the first flag; and

a first encapsulant over the integrated circuit, the first encapsulant having a top surface,

wherein:

each lead of the first plurality of leads having a hole which extends completely through the lead and a bend at its hole; and

a portion of each lead extending from its hole to above the top surface.

11. The package device of claim 10 , further comprising:

a second lead frame having a second flag and a second plurality of leads;

a second integrated circuit on the second flag; and

a second encapsulant over the second integrated circuit, the second encapsulant having a top surface,

wherein:

each lead of the second plurality of leads having a hole which extends completely through the lead and a bend at its hole;

each lead of the first plurality of leads corresponding to a lead of the second plurality of leads; and

each lead of the first plurality of leads has a portion in the hole of its corresponding lead of the second plurality of leads.

12. The package device of claim 11 , wherein a portion of a bottom surface of each lead of the first plurality of leads is exposed.