LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
1 . A laminated electronic component, comprising:
a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body; and
a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor,
wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
2 . The laminated electronic component of claim 1 ,
wherein the current loop is formed in a plane perpendicular to a mounting surface when the laminated electronic component is mounted on a board.
3 . The laminated electronic component of claim 1 , wherein the first capacitor and the second capacitor are connected in series.
4 . The laminated electronic component of claim 1 , wherein the first external electrode on the upper surface of the first ceramic body is electrically connected to the third external electrode, and the second external electrode on the upper surface of the first ceramic body is electrically connected to the fourth external electrode.
5 . The laminated electronic component of claim 1 , wherein the first ceramic body comprises:
a first internal electrode drawn to the upper and lower surfaces of the first ceramic body to be connected to the first external electrodes; and
a second internal electrode overlapping the first internal electrode to form capacitance, and drawn to the upper and lower surfaces of the first ceramic body to be connected to the second external electrodes.
6 . The laminated electronic component of claim 5 , wherein the first and second internal electrodes are disposed to be perpendicular to the lower surface of the first ceramic body.
7 . The laminated electronic component of claim 1 , wherein the second ceramic body comprises:
a third internal electrode drawn to the lower surface of the second ceramic body to be connected to the third external electrode; and
a fourth internal electrode overlapping the third internal electrode to form capacitance, and drawn to the lower surface of the second ceramic body to be connected to the fourth external electrode.
8 . The laminated electronic component of claim 7 , wherein the third and fourth internal electrodes are disposed to be perpendicular to the lower surface of the second ceramic body.
9 . The laminated electronic component of claim 4 , wherein the first and second external electrodes are electrically connected to the third and fourth external electrodes, respectively, by a conductive adhesive.
10 . A mounting board mounting a laminated electronic component, comprising:
a printed circuit board including an electrode pad disposed thereon;
a laminated electronic component mounted on the printed circuit board; and
a solder connecting the electrode pad to the laminated electronic component,
wherein the laminated electronic component comprises:
a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body; and
a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor,
wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
11 . The mounting board mounting a laminated electronic component of claim 10 , further comprising a ceramic substrate disposed between the laminated electronic component and the printed circuit board.
12 . The mounting board mounting a laminated electronic component of claim 11 , wherein the ceramic substrate includes an insulating body, and first and second conductive layers formed on an outer surface of the insulating body,
the first conductive layer is connected to the first external electrode on the lower surface of the first capacitor and the first electrode pad of the printed circuit board, and
the second conductive layer is connected to the second external electrode on the lower surface of the first capacitor and the second electrode pad of the printed circuit board.
13 . The mounting board mounting a laminated electronic component of claim 12 , wherein the first conductive layer extends from one surface in a length direction of the insulating body to upper and lower surfaces of the insulating body, and the second conductive layer extends from the other surface in the length direction of the insulating body to the upper and lower surfaces of the insulating body.
14 . The mounting board mounting a laminated electronic component of claim 12 , wherein the ceramic substrate comprises:
a first conductive via connecting a portion of the first conductive layer disposed on the upper surface of the insulating body to a portion of the first conductive layer disposed on the lower surface of the insulating body and passing through the insulating body, and
a second conductive via connecting a portion of the second conductive layer disposed on the upper surface of the insulating body to a portion of the second conductive layer disposed on the lower surface of the insulating body and passing through the insulating body.
15 . The mounting board mounting a laminated electronic component of claim 10 , wherein the current loop is formed in a plane perpendicular to a mounting surface of the printed circuit board.
16 . The mounting board mounting a laminated electronic component of claim 10 , wherein the first capacitor and the second capacitor are connected in series.
17 . The mounting board mounting a laminated electronic component of claim 12 , wherein the first and second external electrodes are electrically connected to the first and second conductive layers, respectively, by a conductive adhesive.