Semiconductor memory device including semi-selectable memory cells

1. A semiconductor memory device comprising:

a memory cell array having a plurality of first wires, a second wire, and a plurality of memory cells electrically connected to the respective first wires and the second wire; and

a control circuit configured to perform a writing operation in which data is written into the memory cells, wherein

one of the memory cells is a selected memory cell, which is electrically connected to a selected one of the first wires and the second wire,

one of the memory cells is a semi-selected memory cell, which is electrically connected to an unselected one of the first wires and the second wire, and

before performing the writing operation for the selected memory cell, the control circuit performs a pre-sensing operation in which an amount of first current flowing through the second wire is determined when a voltage is applied to the second wire and the plurality of first wires connected to the second wire via the memory cells, the voltage being a voltage to be applied when the plurality of memory cells including the selected memory cell connected to the second wire is set as the semi-selected memory cells.

2. The semiconductor memory device according to claim 1 , wherein, when performing the writing operation for one of the memory cells, the control circuit controls a voltage applied to the second wire on the basis of the amount of first current.

3. The semiconductor memory device according to claim 1 , wherein the control circuit:

has a reference current source configured to feed a reference current, and

determines the amount of the first current by comparing the first current with the reference current during the pre-sensing operation.

4. The semiconductor memory device according to claim 1 , wherein the control circuit:

has a latch circuit, and

retains a result of determining the amount of first current in the latch circuit during the pre-sensing operation.

5. The semiconductor memory device according to claim 1 , wherein

the plurality of first wires extend laterally with respect to a principal plane of a semiconductor substrate, and

the second wire extends vertically with respect to the principal plane of the semiconductor substrate.

6. The semiconductor memory device according to claim 1 , wherein

the memory cell array has a third wire electrically connected to the second wire,

the control circuit is configured to apply a plurality of writing voltages to the third wire, and

when performing the writing operation for the selected memory cell, the control circuit selects one from the plurality of writing voltages on the basis of the first current and applies the one writing voltage to the third wire connected to the second wire.

7. The semiconductor memory device according to claim 6 , wherein the control circuit:

has a reference current source configured to feed a reference current, and

determines the amount of the first current by comparing the first current with the reference current.

8. The semiconductor memory device according to claim 7 wherein the control circuit has a latch circuit configured to retain a result of determining the amount of the first current.

9. The semiconductor memory device according to claim 8 , wherein

the control circuit has a first switching circuit configured to select the one writing voltage, and

the first switching circuit is controlled in accordance with the determination result retained in the latch circuit.

10. The semiconductor memory device according to claim 6 , wherein

when sensing the first current, the control circuit applies a pre-sensing voltage to the third wire connected to the second wire, and

the pre-sensing voltage is lower than any of the plurality of writing voltages.

11. The semiconductor memory device according to claim 10 , wherein the control circuit has a second switching circuit configured to select one of the plurality of writing voltages and the pre-sensing voltage.

12. The semiconductor memory device according to claim 6 , wherein

the plurality of first wires extend laterally with respect to a principal plane of a semiconductor substrate, and

the second wire extends vertically with respect to the principal plane of the semiconductor substrate.

13. The semiconductor memory device according to claim 1 wherein

the memory cell array has a third wire electrically connected to the second wire,

the control circuit is configured to apply a first voltage, a second voltage, a plurality of third voltages, and a fourth voltage to the plurality of first wires and the third wire,

when performing a pre-sensing operation, the control circuit applies the second voltage to the plurality of first wires and applies the fourth voltage to the third wire connected to the wire to flow the first current through the second wire, and

when performing the wiring operation for the selected memory cell, the control circuit:

applies the first voltage to a selected one of the first wires,

applies the second voltage to another one of the first wires,

selects one from the plurality of third voltages on the basis of the first current, and

applies the one third voltage to the third wire connected to the second wire.

14. The semiconductor memory device according to claim 13 , wherein the control circuit:

has a reference current source configured to feed a reference current, and

determines the amount of the first current by comparing the first current with the reference current.

15. The semiconductor memory device according to claim 14 , wherein the control circuit has a latch circuit configured to retain a result of determining the amount of first current.

16. The semiconductor memory device according to claim 15 , wherein

the control circuit has a first switching circuit configured to select the one third voltage, and

the first switching circuit is controlled in accordance with the determination result retained in the latch circuit.

17. The semiconductor memory device according to claim 13 , wherein the control circuit has a second switching circuit configured to select one of the plurality of third voltages and the fourth voltage.

18. The semiconductor memory device according to claim 13 , wherein the fourth voltage is lower than any of plurality of third voltages.

19. The semiconductor memory device according to claim 13 , wherein

the plurality of first wires extend laterally with respect to a principal plane of a semiconductor substrate, and

the second wire extends vertically with respect to the principal plane of the semiconductor substrate.

20. The semiconductor memory device according to claim 13 , wherein

the plurality of memory cells have variable resistance films formed between the respective first wires and the second wire,

when the first voltage is applied to the first wires disposed at one ends of the variable resistance films and the one third voltage is applied to the third wire electrically connected to the second wire disposed at the other ends of the variable resistance films so that a potential difference is generated across the variable resistance films, the variable resistance films make a transition of their resistance states, and

when the first voltage is applied to the first wires disposed at one ends of the variable resistance films and the second voltage is applied to the third wire electrically connected to the second wire disposed at the other ends of the variable resistance films so that a potential difference is generated across the variable resistance films, the variable resistance films maintain their resistance states.