Semiconductor device manufacturing method
A semiconductor device manufacturing method according to an embodiment including partially forming a first groove on a nitride semiconductor layer provided on a first plane of a substrate having first and second planes by etching so that the substrate is exposed, forming a second groove on the substrate exposed inside the first groove so that a portion of the substrate remains, removing the substrate from the second plane side so that the second groove is not exposed, thinning the substrate, forming a metal film on the second plane side of the substrate, removing the metal film in a portion where the second groove is formed, and forming a third groove on the substrate in the portion where the second groove is formed so that the second groove is exposed from the second plane side.
1. A semiconductor device manufacturing method comprising:
forming a first groove partially on a nitride semiconductor layer, the nitride semiconductor layer provided on a first plane of a substrate, the substrate having the first plane and a second plane, the first groove being formed by etching so that the substrate is exposed;
forming a second groove on the substrate exposed inside the first groove after forming the first grove, the second groove being formed so that a portion of the substrate remains;
thinning the substrate by removing a part of the substrate from the second plane side after forming the second grove, the part of the substrate being removed so that the second groove is not exposed;
forming a metal film on the second plane side of the substrate after thinning the substrate;
removing the metal film in a portion where the second groove is formed; and
forming a third groove on the substrate from the second plane side after removing the metal film, the third groove being formed in the portion where the second groove is formed, the third groove being formed so that the second groove is exposed.
2. The semiconductor device manufacturing method according to claim 1 , further comprising bonding a support member on the nitride semiconductor layer, before the thinning the substrate.
3. The semiconductor device manufacturing method according to claim 1 , wherein the second groove is formed by blade dicing.
4. The semiconductor device manufacturing method according to claim 1 , wherein the second groove is formed by dry etching.
5. The semiconductor device manufacturing method according to claim 1 , wherein the third groove is formed by blade dicing.
6. The semiconductor device manufacturing method according to claim 1 , wherein the removing of the metal film and the forming of the third groove are simultaneously performed by blade dicing.
7. The semiconductor device manufacturing method according to claim 1 , wherein a width of the third groove is larger than a width of the second groove.
8. The semiconductor device manufacturing method according to claim 1 , wherein, in the thinning the substrate, a thickness of the substrate after the thinning in the portion where the second groove is formed is set to be 20 μm or more and 50 μm or less.
9. The semiconductor device manufacturing method according to claim 1 , wherein the substrate is a silicon substrate.
10. The semiconductor device manufacturing method according to claim 1 , wherein the nitride semiconductor layer is a GaN-based semiconductor layer.
11. The semiconductor device manufacturing method according to claim 9 , wherein a thickness of the silicon substrate is 1 mm or more and 2 mm or less.
12. The semiconductor device manufacturing method according to claim 10 , wherein a thickness of the GaN-based semiconductor layer is 5 μm or more and 10 μm or less.
13. The semiconductor device manufacturing method according to claim 1 , wherein the metal film is a film containing nickel.
14. The semiconductor device manufacturing method according to claim 10 , wherein the GaN-based semiconductor layer includes a GaN layer and an AlGaN layer.
15. The semiconductor device manufacturing method according to claim 1 , wherein, in the thinning the substrate, a thickness of the substrate after the thinning is set to be 100 μm or more and 200 μm or less.
16. The semiconductor device manufacturing method according to claim 1 , wherein, in the thinning of the substrate, grinding using a diamond wheel is performed.
17. The semiconductor device manufacturing method according to claim 2 , wherein the support member is a glass substrate.
18. The semiconductor device manufacturing method according to claim 1 , wherein the first groove is formed by dry etching.
19. The semiconductor device manufacturing method according to claim 1 , further comprising bonding a support member on the nitride semiconductor layer, before the thinning the substrate,
wherein
the first groove is formed by dry etching,
the second groove is formed by blade dicing, and
the removing of the metal film and the forming of the third groove are simultaneously performed by blade dicing, and
a width of the third groove is larger than a width of the second groove.
20. The semiconductor device manufacturing method according to claim 1 , further comprising bonding a support member on the nitride semiconductor layer, before the thinning the substrate,
wherein
the first groove is formed by dry etching,
the second groove is formed by dry etching,
the removing of the metal film and the forming of the third groove are simultaneously performed by blade dicing, and
a width of the third groove is larger than a width of the second groove.