Electronic component and electronic component series including the same

1. An electronic component comprising:

a component main body in which an internal conductor is embedded; and

an outer electrode provided on an outer surface of the component main body; wherein

the component main body includes an end surface on which the internal conductor is exposed, and a main surface that is continuous with the end surface and intersects with the end surface;

the outer electrode includes an end surface covering portion connected to the internal conductor by covering at least a portion of the internal conductor exposed on the end surface, and a main surface covering portion that covers at least a portion of the main surface;

at least a portion of an exposed surface of the main surface covering portion includes a Sn plating layer;

at least a portion of an exposed surface of the end surface covering portion includes a Sn—Ni layer containing an intermetallic compound of Sn and Ni; and

at least a portion of the Sn—Ni layer is disposed underneath the Sn plating layer.

2. The electronic component according to claim 1 , wherein a surface of the Sn—Ni layer of the exposed surface of the end surface covering portion includes a plurality of projections.

3. The electronic component according to claim 2 , wherein the projections have flat or substantially flat flake shapes.

4. The electronic component according to claim 1 , wherein the end surface covering portion includes a Ni plating layer, and the Sn—Ni layer of the exposed surface of the end surface covering portion provided on the Ni plating layer.

5. The electronic component according to claim 1 , wherein the main surface covering portion includes a Ni plating layer, a Sn—Ni layer provided on the Ni plating layer, and the Sn plating layer of the exposed surface of the main surface covering portion provided on the Sn—Ni layer.

6. The electronic component according to claim 4 , wherein the end surface covering portion and/or the main surface covering portion includes a Cu-containing layer containing Cu and the Ni plating layer provided on the Cu-containing layer.

7. The electronic component according to claim 1 , wherein an exposed surface on an end portion of the main surface covering portion, the end portion being a portion that intersects with the main surface, includes a Sn—Ni layer containing an intermetallic compound of Sn and Ni.

8. The electronic component according to claim 1 , wherein the Sn plating layer of the exposed surface of the main surface covering portion extends from the main surface covering portion to a portion of the end surface covering portion.

9. The electronic component according to claim 8 , wherein the internal conductor is not located on an imaginary plane that follows a shortest path between an edge portion on the end surface covering portion and an edge portion on the main surface covering portion in the Sn plating layer extending from the main surface covering portion to a portion of the end surface covering portion.

10. The electronic component according to claim 1 , wherein the electronic component is a multilayer ceramic capacitor.

11. The electronic component according to claim 1 , wherein the outer electrode includes a sintered metal layer and plating layers laminated together.

12. The electronic component according to claim 1 , wherein the outer electrode includes a Cu-containing layer, an Ni plating layer, and the Sn—Ni layer throughout an entirety thereof.

13. The electronic component according to claim 12 , wherein a portion of the Sn—Ni layer is covered by the Sn plating layer.

14. The electronic component according to claim 1 , wherein exposed surfaces of both the main surface covering portion located on a first main surface side of the component main body and the main surface covering portion located on a second main surface side are covered by the Sn plating layer.

15. The electronic component according to claim 1 , wherein the component main body defines an element housing and includes a plurality of dielectric material layers and a plurality of conductive material layers laminated in a height direction of the electronic component.

16. The electronic component according to claim 1 , wherein the component main body defines an element housing and includes a plurality of dielectric material layers and a plurality of conductive material layers laminated in a width direction of the electronic component.

17. A mounting structure comprising:

a circuit board including a land;

the electronic component according to claim 1 mounted on the circuit board such that the land is connected to the outer electrode by solder.

18. The mounting structure according to claim 17 , wherein the solder is spaced away from the exposed surface of the main surface covering portion located on a side opposite from the end surface covering portion.

19. An electronic component series comprising:

a plurality of the electronic components according to claim 1 ; and

a package including an elongated carrier tape provided with a plurality of recesses with intervals therebetween, and a cover tape affixed to the carrier tape so as to cover the plurality of recesses; wherein

the plurality of electronic components are accommodated in the plurality of corresponding recesses such that the main surface of each of the plurality of electronic components faces a base portion of each of the plurality of corresponding recesses.

20. The electronic component series according to claim 19 , wherein the plurality of electronic components are multilayer ceramic capacitors.